Latest News

TECDIA, Co. Ltd. (Shanghai) Relocated

TECDIA Co., Ltd. Shanghai has moved to a new location in order to meet growing business needs. For further contact information please see the link below:
https://us.tecdia.com/about-us-global-network/

New Case Study: Verdis Dispensing Nozzles used in 3D Bioprinting Research

Please visit the below link to see Tecdia’s latest case study, “Verdis Dispensing Nozzles used in 3D Bioprinting Research”.

Tecdia Exhibiting at 2015 International Touch Panel and Optical Film Exhibition

Tecdia will be showcasing our Verdis dispensing nozzles and other precision products at the 2015 International Touch Panel and Optical Film Exhibition, August 26th to 28th. Come see us at booth I221 at Nangang Exhibition Hall in Taipei, Taiwan
http://www.touchtaiwan.com/en/index.asp

Tecdia Exhibiting at Transport System Expo 2015 (Tokyo, Japan)

Tecdia will be showcasing our commuter safety system for children and the elderly, Kids Beacon (R) and Silver Beacon (R). See us at booth 1-2-9 at Tokyo Big Sight, May 27th to 29th.
http://www.truckexpo.jp/2015/en/index.html

Tecdia Exhibiting at 6th Educational IT Solutions Expo (Tokyo, Japan)

Tecdia will be showcasing our commuter safety system for children and the elderly, Kids Beacon (R) and Silver Beacon (R). See us at booth 8-7 in the Security Zone at Tokyo Big Sight, May 20th to 22nd.
http://www.edix-expo.jp/en/

Sequencing Power Supply Board Discontinuation Notice

Tecdia will be discontinuing Sequencing Power Supply Boards.
Last Order Date: December 31, 2015
Last Delivery Date: March 31, 2016

Click Here for More Information

Tecdia Exhibiting at 2015 MTTS International Microwave Symposium

May 19-21, Tecdia will be exhibiting at the 2015 MTTS International Microwave Symposium in Phoenix, Arizona at booth 1345. We will showcase our latest HCT (Hybrid Ceramic Technologies) and single layer chip capacitors.

Tecdia Exhibiting at OFC 2015

(March 24-26, 2015) Tecdia will be exhibiting at the Optical Fiber Coummunication Conference and Exposition (OFC) show in Los Angeles, CA. This year we will be showcasing the latest in high performance Lightwave submount design with fine patterning and 3D shapes. Please visit us in booth 2416!

http://www.ofcconference.org/en-us/home/

Tecdia Exhibiting at ATEM Fair 2015

Tecdia is exhibiting at the 2015 ATEM Fair (7th International Adhesive, Coasting and Film System Fair) at Songdo Convensia in Incheon Korea at Booth #I121 from March 18th to 20th. We will be showcasing our dispensing nozzles and precision tools. See you there!

http://www.atemfair.com/sp2.php?p=11_en

Tecdia Exhibiting at 44th Internepcon Japan

January 14-16, Tecdia will be exhibiting at the 2015 Internepcon in Tokyo Big Sight, Japan. We will be showcasing our dispensing nozzles, diamond technologies and precision tools. See you there at Booth 12-13 in the East Exhibition Hall!

http://www.nepcon.jp/en/

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