Latest News

Tecdia Introduces New Handy Wafer Scriber Section on Website

Handy Wafer Scriber has been added to our Solutions section.
http://www.tecdia.com/us/case/11.php

Tecdia Inc. (US) Relocated

Our Tecdia Inc. (US) office was relocated to Campbell, CA – about 10 miles south of our previous Santa Clara office.
http://www.tecdia.com/us/company/global.php#02

TECDIA, Co. LTD. (KOREA) Relocated

TECDIA Co., Ltd. KOREA has moved to a new location at #704, 303 Hyowon-ro, Paldal-gu Suwon, Gyeonggi-do, Korea 442-835.
http://www.tecdia.com/us/company/global.php#05

Tecdia Exhibits at 2014 MTTS International Microwave Symposium

Tecdia exhibited at the 2014 MTTS International Microwave Symposium held in the Tampa Convention Center located in Tampa Bay, Florida (Booth 1818) June 3rd thorough 5th. We showcased our new Hybrid Ceramic Technologies (HCT), Single Layer Chip Capacitors and other microwave products.
http://www.ims2014.org/

Tecida Adds CMI (Cebu Microelectronics Inc.) Video to Website

The introduction video for CMI (Cebu Microelectronics Inc.) has been added to the “Contract Manufacturing Service (CMS)” page.
http://www.tecdia.com/us/products/cm/

“Conflict Mineral Policy” Added to Corporate Policies Page

“Conflict Mineral Policy” has been added to Corporate Policies under the “About Us” page.
http://www.tecdia.com/us/company/conflict.php

Tecdia Exhibits at 14th Annual Fiver Optics Expo (FOE2014) in Japan

Tecdia exhibited at the 14th Annual Fiber Optics Expo (FOE2014) at Tokyo Big Sight in Japan. We showcased contract manufacturing of 100G coherent module devices, brand new ceramic and thin film technologies code named Hybrid Ceramic Technology as well as our Single Layer Ceramic Chip Capacitors on April 16th through 18th.
http://www.foe.jp/en/

Tecdia Exhibits at 2014 Electronic Design Innovation Conference in China

Tecdia exhibited at the Electronic Design Innovation Conference (EDICON 2014) in Beijing, China at booth #611. We showcased Single Layer Ceramic Chip Capacitors, “ALTAS” Ultra Hi-K products, Broadband High Current Bias-T’s, and DC Power Boards for FET protection on April 8th through 10th.
http://www.ediconchina.com/

Tecdia Exhibits at Atem Fair 2014

Tecdia exhibited at the ATEM FAIR 2014, the Adhesive, Coating and Film System Fair at Songdo CONVENSIA, Incheon. We showcased our products based on precision machine and diamond process technologies at booth #G119 on March 19th through 21st.
http://www.atemfair.com/?doc=eng_main.php&md=english

Tecdia Exhibits OFC/NFOEC Show

Tecdia exhibited at the 2014 OFC/NFOEC show in San Francisco, CA. This year showcased the latest in high performance Lightwave submount design with exotic patterning and 3D shapes on March 11th through 13th.
http://www.ofcconference.org/home

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