|Wafer Processing Equipment Business Division Transfer||
We are pleased to announce that we have transferred our Wafer Processing Equipment Business Division to our company Kumasan Medix Co., Ltd. as described below.
Date of business transfer agreement conclusion: December 13 2017
|Tecdia Exhibiting at 2017 European Microwave Week||
October 10-12, Tecdia exhibited at the 2017 European Microwave Week Exhibition in Nuremburg, Germany at booth 143. Thank you to all that stopped by and asked us about our single layer capacitors (with new backside AuSn!and the latest capabilities of our HCT alumina/aluminum nitride substrate line.
|Tecdia Exhibiting at 2017 MTTS International Microwave Symposium||
June 6-8, Tecdia will be exhibiting at the 2017 MTTS International Microwave Symposium in Honolulu, Hawaii at booth 708. Stop by and ask us about our single layer capacitors and the latest capabilities of our HCT alumina/aluminum nitride substrate line.
|Tecdia Exhibiting at EDICON 2017||
April 25-27, Tecdia will be exhibiting at the Electronic Design Innovation Conference (EDICON 2017) at the Shanghai Convention & Exhibition Center of International Sourcing in China at booth 113. We will be showcasing our single layer ceramic capacitors and alumina thin film circuit boards in addition to introducing our ceramic circuit production technologies (HCT – Hybrid Ceramic Technologies).
|Tecdia Exhibiting at OFC 2017||
March 21-23, Tecdia will be exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) show in Los Angeles, CA. This year we will be showcasing the latest in high performance Lightwave submount design with fine patterning and 3D shapes. Please visit us in booth 1940!
Office Hours: 8:30am - 5:30pm PST