News

On September 16th – 18th 2021 Tecdia will be attending the CIOE2021 Conference [The 23rd China International Optoelectronic Exposition] in Shenzhen, China!

We will be showcasing our Single Layer Capacitors!

We hope to see you there!

For details on the conference please click here!

Tecdia will be attending the ICEF (China Electronics Fair) on July 15th – July 17th 2021.

We will be showcasing our Single Layer Wire Bondable Capacitors that can be applied to 5G and satellite communications, precision machining products and our Diamond tools!

Our booth number will be 4B253!

Come visit our booth!

For more details about the conference, you can Click Here.

Tecdia is pleased to announce that we will be exhibiting at IMS 2021 and OFC 2021.

Both exhibits are set to start on June 6th – 11th

IMS 2021:

We will be exhibiting live in Atlanta in booth 1613 and on the IMS virtual platform.

The IMS Virtual Exhibit will start on June 20th – 25th

Our R&D Director, Daniel Young and FAE, Mark Simpson will be in the live exhibit to answer any questions.

OFC 2021:

Our R&D Lab Engineer, Takuya Toyohara and Field Applications Engineer, Wesley Chu will be available to chat on the virtual platform!

We hope that you will come to visit our virtual booth and physical booth, where we will be highlighting our newest product additions like the 5G Varactors, tight tolerance ultra-small resistors, conventional capacitor and thin film substrate products.

if you have any questions, you can send us a chat or we can set up a meeting where we can further discuss your questions.
IMS and OFC can only be accessed by those registered.

Click Here to register for IMS
Click Here to register for OFC

We hope to see you there!
Regards,
Tecdia Team