Latest News

Tecdia Exhibiting at OFC 2018

March 13-15, Tecdia will be exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) show in San Diego, CA. This year we will be showcasing our latest ceramic products, thin film substrate line and contract manufacturing/micro-assembly services. Please visit us in booth 4731!
http://www.ofcconference.org/en-us/home/

Wafer Processing Equipment Business Division Transfer

We are pleased to announce that we have transferred our Wafer Processing Equipment Business Division to our company Kumasan Medix Co., Ltd. as described below.
For details, click here.

Date of business transfer agreement conclusion: December 13 2017
Business transfer date: January 31 2018

Tecdia Exhibiting at 2017 European Microwave Week

October 10-12, Tecdia exhibited at the 2017 European Microwave Week Exhibition in Nuremburg, Germany at booth 143. Thank you to all that stopped by and asked us about our single layer capacitors (with new backside AuSn!and the latest capabilities of our HCT alumina/aluminum nitride substrate line.
http://www.eumweek.com/

Tecdia Exhibiting at 2017 MTTS International Microwave Symposium

June 6-8, Tecdia will be exhibiting at the 2017 MTTS International Microwave Symposium in Honolulu, Hawaii at booth 708. Stop by and ask us about our single layer capacitors and the latest capabilities of our HCT alumina/aluminum nitride substrate line.
http://www.ims2017.org/

Tecdia Exhibiting at EDICON 2017

April 25-27, Tecdia will be exhibiting at the Electronic Design Innovation Conference (EDICON 2017) at the Shanghai Convention & Exhibition Center of International Sourcing in China at booth 113. We will be showcasing our single layer ceramic capacitors and alumina thin film circuit boards in addition to introducing our ceramic circuit production technologies (HCT – Hybrid Ceramic Technologies).
http://www.ediconchina.com/

Tecdia Exhibiting at OFC 2017

March 21-23, Tecdia will be exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) show in Los Angeles, CA. This year we will be showcasing the latest in high performance Lightwave submount design with fine patterning and 3D shapes. Please visit us in booth 1940!
http://www.ofcconference.org/en-us/home/

New Ground Block Case Study

We have added a case study about Tecdia’s new Ground Block to our case study library to share a little information on the origins of the Ground Block.
https://us.tecdia.com/casestudies/ground-block-using-conductive-ceramic/

Ground Block Page Addition

We have added a listing describing our new conductive ceramic Ground Blocks to the ceramic products overview page.
https://us.tecdia.com/products-services/ceramic-products-overview/ground-blocks/

New K=50,000 Dielectric Released

We have added our new K=50,000 dielectric single layer capacitor series to our ALTAS® Ultra High-K ceramic capacitor page.
https://us.tecdia.com/products-services/products-list/

Tecdia Website for India

We have launched a new website especially for the expanding Indian market that emphasizes our range of Ceramic Products.
http://www.tecdia.com/in/

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