| “Conflict Mineral Policy” Added to Corporate Policies Page | “Conflict Mineral Policy” has been added to Corporate Policies under the “About Us” page. |
| Tecdia Exhibits at 14th Annual Fiver Optics Expo (FOE2014) in Japan | Tecdia exhibited at the 14th Annual Fiber Optics Expo (FOE2014) at Tokyo Big Sight in Japan. We showcased contract manufacturing of 100G coherent module devices, brand new ceramic and thin film technologies code named Hybrid Ceramic Technology as well as our Single Layer Ceramic Chip Capacitors on April 16th through 18th. |
| Tecdia Exhibits at 2014 Electronic Design Innovation Conference in China | Tecdia exhibited at the Electronic Design Innovation Conference (EDICON 2014) in Beijing, China at booth #611. We showcased Single Layer Ceramic Chip Capacitors, “ALTAS” Ultra Hi-K products, Broadband High Current Bias-T’s, and DC Power Boards for FET protection on April 8th through 10th. |
| Tecdia Exhibits at Atem Fair 2014 | Tecdia exhibited at the ATEM FAIR 2014, the Adhesive, Coating and Film System Fair at Songdo CONVENSIA, Incheon. We showcased our products based on precision machine and diamond process technologies at booth #G119 on March 19th through 21st. |
| Tecdia Exhibits OFC/NFOEC Show | Tecdia exhibited at the 2014 OFC/NFOEC show in San Francisco, CA. This year showcased the latest in high performance Lightwave submount design with exotic patterning and 3D shapes on March 11th through 13th. |
| Tecdia Releases New Webpage Highlighting Ceramic Substrate Line | Tecdia is proud to release a new webpage with details regarding our new high performance ceramic substrate line, code named HCT. HCT offers engineers unparalleled design flexibility and extremely tight tolerances. Please visit the below website for details. |
| Tecdia Exhibitsat the 2014 MD&M | Tecdia exhibited at the 2014 MD&M West in Anaheim, CA at booth 919. We showcased our Dispensing Nozzle product line, Diamond Indenter, and diamond/Ti process technologies on February 11th through 13th. |
| Tecdia Exhibits at 43rd Internepcon Japan | Tecdia exhibited at 43rd INTERNEPCON JAPAN at Tokyo Big Sight. We showcased our Diamond Industrial Products, Precision Machined Products and Contract Manufacturing service at the East Hall booth # 41-15 on January 15th through 17th. |
“Diamond Indenter” page has been added to the Diamond Industrial Products line. |
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Tecdia exhibited at the Microwave Workshops & Exhibition (MWE 2013) being held at the Pacifico Yokohama in Kanagawa, Japan at booth C601. We will showcase our brand new ceramic thin film technology along with Single Layer Capacitors, Wide-Band/High-Voltage Bias-Ts, DC Power Boards, and Contract Manufacturing Services on November 27th through 29th. |
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