Latest News

Tecdia Exhibiting at 44th Internepcon Japan

January 14-16, Tecdia will be exhibiting at the 2015 Internepcon in Tokyo Big Sight, Japan. We will be showcasing our dispensing nozzles, diamond technologies and precision tools. See you there at Booth 12-13 in the East Exhibition Hall!

http://www.nepcon.jp/en/

Tecdia Exhibiting at the 2015 MD&M

Tecdia is exhibiting at the 2015 MD&M West in Anaheim, CA at booth 2982 from February 10th through 12th. We will showcase our bio-printing dispensing nozzles and systems.  See you there!

http://mdmwest.mddionline.com/

Tecdia Inc. opens Europe Branch

To meet growing business needs and to further improve our customer service, Tecdia Inc. has opened a new branch office in Europe on November 17, 2014.

Exhibition at the 2014 European Microwave Week held at Fiera de Roma

(October 5-10, 2014) Tecdia will exhibit at the 2014 European Microwave Week held at Fiera de Roma in Rome, Italy (Stand 188). This year we will showcase developments in our new HCT (Hybrid Ceramic Technologies) substrate line along with our well known Single Layer Chip Capacitors. Please come by and visit!
http://www.eumweek.com/

Exhibition at the 2014 ECOC

(September 22-24, 2014) Tecdia will exhibit at the 2014 ECOC (European Conference on Optical Communications) held in the Palais des Festivals Convention Center located in Cannes, France (Booth 502). This year we will showcase developments in our new HCT (Hybrid Ceramic Technologies) substrate line along with our well known Single Layer Chip Capacitors. Please come by and visit!
http://www.ecocexhibition.com/

New Product : Zirconium Nozzles

(July 22, 2014) Zirconium Nozzles nozzle has been added to the Precision Machined products line.

Tecdia Introduces New Handy Wafer Scriber Section on Website

Handy Wafer Scriber has been added to our Solutions section.
http://www.tecdia.com/us/case/11.php

Tecdia Inc. (US) Relocated

Our Tecdia Inc. (US) office was relocated to Campbell, CA – about 10 miles south of our previous Santa Clara office.
http://www.tecdia.com/us/company/global.php#02

TECDIA, Co. LTD. (KOREA) Relocated

TECDIA Co., Ltd. KOREA has moved to a new location at #704, 303 Hyowon-ro, Paldal-gu Suwon, Gyeonggi-do, Korea 442-835.
http://www.tecdia.com/us/company/global.php#05

Tecdia Exhibits at 2014 MTTS International Microwave Symposium

Tecdia exhibited at the 2014 MTTS International Microwave Symposium held in the Tampa Convention Center located in Tampa Bay, Florida (Booth 1818) June 3rd thorough 5th. We showcased our new Hybrid Ceramic Technologies (HCT), Single Layer Chip Capacitors and other microwave products.
http://www.ims2014.org/

Tecida Adds CMI (Cebu Microelectronics Inc.) Video to Website

The introduction video for CMI (Cebu Microelectronics Inc.) has been added to the “Contract Manufacturing Service (CMS)” page.
http://www.tecdia.com/us/products/cm/

“Conflict Mineral Policy” Added to Corporate Policies Page

“Conflict Mineral Policy” has been added to Corporate Policies under the “About Us” page.
http://www.tecdia.com/us/company/conflict.php

Tecdia Exhibits at 14th Annual Fiver Optics Expo (FOE2014) in Japan

Tecdia exhibited at the 14th Annual Fiber Optics Expo (FOE2014) at Tokyo Big Sight in Japan. We showcased contract manufacturing of 100G coherent module devices, brand new ceramic and thin film technologies code named Hybrid Ceramic Technology as well as our Single Layer Ceramic Chip Capacitors on April 16th through 18th.
http://www.foe.jp/en/

Tecdia Exhibits at 2014 Electronic Design Innovation Conference in China

Tecdia exhibited at the Electronic Design Innovation Conference (EDICON 2014) in Beijing, China at booth #611. We showcased Single Layer Ceramic Chip Capacitors, “ALTAS” Ultra Hi-K products, Broadband High Current Bias-T’s, and DC Power Boards for FET protection on April 8th through 10th.
http://www.ediconchina.com/

Tecdia Exhibits at Atem Fair 2014

Tecdia exhibited at the ATEM FAIR 2014, the Adhesive, Coating and Film System Fair at Songdo CONVENSIA, Incheon. We showcased our products based on precision machine and diamond process technologies at booth #G119 on March 19th through 21st.
http://www.atemfair.com/?doc=eng_main.php&md=english

Tecdia Exhibits OFC/NFOEC Show

Tecdia exhibited at the 2014 OFC/NFOEC show in San Francisco, CA. This year showcased the latest in high performance Lightwave submount design with exotic patterning and 3D shapes on March 11th through 13th.
http://www.ofcconference.org/home

Tecdia Releases New Webpage Highlighting Ceramic Substrate Line

Tecdia is proud to release a new webpage with details regarding our new high performance ceramic substrate line, code named HCT. HCT offers engineers unparalleled design flexibility and extremely tight tolerances. Please visit the below website for details.

Tecdia Exhibitsat the 2014 MD&M

Tecdia exhibited at the 2014 MD&M West in Anaheim, CA at booth 919. We showcased our Dispensing Nozzle product line, Diamond Indenter, and diamond/Ti process technologies on February 11th through 13th.

Tecdia Exhibits at 43rd Internepcon Japan

Tecdia exhibited at 43rd INTERNEPCON JAPAN at Tokyo Big Sight. We showcased our Diamond Industrial Products, Precision Machined Products and Contract Manufacturing service at the East Hall booth # 41-15 on January 15th through 17th.
http://www.nepcon.jp/en/

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