Latest News
Tecdia Exhibiting at CIOE 2019
From September 4, 2019 until September 7, 2019, Tecdia will be exhibiting at CIOE 2019 (China International Optoelectronic Exposition) in Shenzhen, China. Come visit us at booth 1A87-7/1A87-8 to learn more about our advanced ceramic products, thin film circuit technology, precision machining technologies, and custom-order production service. See here for details: http://www.cioe.cn/en/zsml/bull_detail_533.html
Wednesday August 21, 2019New Predeposited AuSn Solder Case Study
A new case study to share our new AuSn solder-ready single layer capacitors has been added to the case study page. Check it our here: https://us.tecdia.com/casestudies/ceramic-capacitor-with-predeposited-solder/
Tuesday June 25, 2019New One-Stop Manufacturing/Assembly Case Study
We have uploaded a new case study to outline our new services combining Tecdia-made electronic components, consigned miscellaneous components and in-house assembly capabilities. Check it our here: https://us.tecdia.com/casestudies/one-stop-manufacturing-assembly-services/
Thursday March 21, 2019