News

April 25-27, Tecdia will be exhibiting at the Electronic Design Innovation Conference (EDICON 2017) at the Shanghai Convention & Exhibition Center of International Sourcing in China at booth 113. We will be showcasing our single layer ceramic capacitors and alumina thin film circuit boards in addition to introducing our ceramic circuit production technologies (HCT – Hybrid Ceramic Technologies).
http://www.ediconchina.com/

March 21-23, Tecdia will be exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) show in Los Angeles, CA. This year we will be showcasing the latest in high performance Lightwave submount design with fine patterning and 3D shapes. Please visit us in booth 1940!
http://www.ofcconference.org/en-us/home/

We have added a case study about Tecdia’s new Ground Block to our case study library to share a little information on the origins of the Ground Block.
https://us.tecdia.com/casestudies/ground-block-using-conductive-ceramic/

We have added a listing describing our new conductive ceramic Ground Blocks to the ceramic products overview page.
https://us.tecdia.com/products-services/ceramic-products-overview/ground-blocks/

We have added our new K=50,000 dielectric single layer capacitor series to our ALTAS® Ultra High-K ceramic capacitor page.
https://us.tecdia.com/products-services/products-list/

We have launched a new website especially for the expanding Indian market that emphasizes our range of Ceramic Products.
http://www.tecdia.com/in/

August 24-26, Tecdia will be exhibiting at the Int’l Smart Display & Touch Panel Exhibition 2016 at Nangang Exhibition Hall in Taipei, Taiwan at booth N527. We will be showcasing various precision nozzles, including our versatile dispenser Verdis nozzle line.
http://www.touchtaiwan.com/en/index.asp/

May 24-26, Tecdia will be exhibiting at the 2016 MTTS International Microwave Symposium in San Francisco, California at booth 1848. We will be showcasing Thin Film Ceramic Components and our HCT Substrate line for Transistor Packages.
http://www.ims2016.org/

March 22-24, Tecdia will be exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) show in Anaheim, CA. This year we will be showcasing the latest in high performance Lightwave submount design with fine patterning and 3D shapes. Please visit us in booth 2343!
http://www.ofcconference.org/en-us/home/

Due to shifts in market demand, Tecdia regrets to announce the obsolescence of all Microwave products including Bias Tees and RF Power Amplifiers. Purchase orders for last time buys must be submitted before May 31, 2016 with final deliveries occurring no later than August 1, 2016. We appreciate your continued support. Click PDF link for more information.