“Diamond Indenter” page has been added to the Diamond Industrial Products line. |
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Tecdia exhibited at the Microwave Workshops & Exhibition (MWE 2013) being held at the Pacifico Yokohama in Kanagawa, Japan at booth C601. We will showcase our brand new ceramic thin film technology along with Single Layer Capacitors, Wide-Band/High-Voltage Bias-Ts, DC Power Boards, and Contract Manufacturing Services on November 27th through 29th. |
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Cebu Microelectronics Inc (CMI)- Tecdia’s fully owned contract facility located in the Philippines has remained intact following the devastating Haiyan Typhoon. We are fortunate to report our employees and facility are safe and operations are normal. |
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To meet growing business and to further improve our customer service, Tecdia Taiwan office has been relocated from Tao Yuan City to New Taipei City. |
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An instructional video has been added to the “Handy Wafer Scriber” page. |
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Tecdia exhibited at the European Conference on Optical Communications (ECOC 2013) being held at the ICC London ExCel. We showcased our IRC (Integrated Resistor-Capacitor) and “ALTAS®” Ultra Hi-K Row Capacitors for 40G and 100G applications. We also demonstrated new developments in ceramic technology, offering unconventional shapes in fully customizable substrates on September 23rd through 25th. |
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Tecdia exhibited at the 15th annual China Int’l Optoelectronic Expo (CIOE 2013) in Shenzhen, China. We highlighted our “ALTAS®” Ultra Hi-K Single Layer Capacitors and Precision Dispensing Nozzles on September 4th through 7th. |
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Tecdia exhibited at the OPTO Taiwan which was held in Taipei. We showcased our Precision Nozzles, Handy Wafer Scriber, High-Speed Grinding Wheel, and our Dressless Wheel on June 18th through 20th. |
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Tecdia exhibited at the 2013 IEEE MTTS International Microwave Symposium in Seattle, Washington. We showcased the IRC (Integrated Resistor and Capacitor), “ALTAS” Ultra Hi-K Row Capacitors, GaN Bias-T’s and DC Power boards. We also demonstrated new developments in ceramic technology, offering unconventional shapes in fully customizable substrates on June 4th through 6th. |
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To expand our service, Tecdia Japan Headquarters has moved to new location at 4-3-4 Shibaura, Minato-ku Tokyo. |
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Tecdia exhibited at the 13th Annual Fiber Optics Expo (FOE2013) in Tokyo Japan. We showcased Contract Manufacturing of 100G Coherent module devices, Single Layer Ceramic Chip Capacitors, and Thin Film Chip Resistors on April 10th through 12th.. |
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Tecdia exhibited at the OFC/NFOEC 2013 show in Anaheim, CA. We showcased our IRC and Ultra Hi-K Row Capacitors for 40G and 100G applications on March 19th through 21th. |
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Tecdia exhibited at the Electronic Design Innovation Conference (EDICON 2013) in Beijing, China. We showcased Single Layer Ceramic Chip Capacitors including standard dielectrics and “ALTAS” Ultra Hi-K products, Bias-T’s, and DC Power Boards for FET protection on March 12th through 14th. |
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For the first time, Tecdia exhibited at the 2013 MD&M West Tradeshow in Anaheim, CA. We showcased our new line of precision dispensing nozzles on February 12th through 14th. |
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Tecdia exhibited at the 42nd INTERNEPCON exhibition in Tokyo, Japan. We showcased our Diamond Industrial Products, and Precision Machined Products on January 16th through 18th. |
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