Latest News

Tecdia Exhibiting at IMS and OFC 2021

Tecdia is pleased to announce that we will be exhibiting at IMS 2021 and OFC 2021.

Both exhibits are set to start on June 6th – 11th

IMS 2021:

We will be exhibiting live in Atlanta in booth 1613 and on the IMS virtual platform.

The IMS Virtual Exhibit will start on June 20th – 25th

Our R&D Director, Daniel Young and FAE, Mark Simpson will be in the live exhibit to answer any questions.

OFC 2021:

Our R&D Lab Engineer, Takuya Toyohara and Field Applications Engineer, Wesley Chu will be available to chat on the virtual platform!

We hope that you will come to visit our virtual booth and physical booth, where we will be highlighting our newest product additions like the 5G Varactors, tight tolerance ultra-small resistors, conventional capacitor and thin film substrate products.

if you have any questions, you can send us a chat or we can set up a meeting where we can further discuss your questions.
IMS and OFC can only be accessed by those registered.

Click Here to register for IMS
Click Here to register for OFC

We hope to see you there!
Regards,
Tecdia Team

Tecdia Status after Covid-19

Tecdia would like to take the time to give you an update of the status of our Factory in the Philippines.

The local government of the Philippines has loosened COVID-19 restrictions however the uncertainty in the region remains to be closely monitored.
We process orders in a FIFO manner and we endeavor to maximize the production capacity, we have a large backlog that we are doing our best to clear without leaving customers short of supplies.

We appreciate and recommend that you place any orders planned in the future sent to us as early as feasible to avoid disappointment.  We will continue to work on a case-by-case basis to expedite orders that require immediate deliveries.

We sincerely appreciate all of the patience and understanding you have shown us over the past several months as we continue to fight COVID-19 together. If you have any questions, please do not hesitate to contact us.

Have a wonderful day!

Tecdia Exhibiting in IMS 2020

Tecdia is pleased to announce that we will be exhibiting at IMS 2020.

We hope that you will come to visit our virtual booth, where we will be highlighting our newest product addition 5G Varactors, tight tolerance ultra-small resistors and conventional capacitor and thin film substrate products.

We will be having a small presentation at the following hours:

August 4th – 6th
10:00 AM PST – Company Introduction (30 Mins + Q&A)
1:00 PM PST – New Tecdia Varactors with Daniel Young (15 Mins + Q&A)
4:00 PM PST – Company Introduction (30 Mins + Q&A)

Our staff will be manning the virtual booth, so if you have any questions, you can send us a chat or we can set up a meeting where we can further discuss your questions.

IMS can only be accessed by those registered, the good news is that it is Free to register!

Click Here to register

We hope to see you there!

Regards,
Tecdia Team

Tecdia Shenzhen Office Now Open

Tecdia’s Shenzhen office has just been opened in a strategically selected location close to the booming semiconductor components hub of China. This will enable Tecdia to provide even greater sales support to the many advanced technology manufacturers in the area. See here for a timeline of Tecdia company history: https://us.tecdia.com/about-us-overview/

Tecdia Exhibiting at OFC 2020

March 10-12, Tecdia will be exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) show in San Diego, CA. This year we will be showcasing the latest in thin film ceramic capacitors and our new line of micro-sized tight-tolerance resistors. Please visit us in booth 3554!
http://www.ofcconference.org/en-us/home/

New Dispensing Nozzle Application Case Study

A new case study to share how our dispensing nozzles can be used in exchange for OEM nozzles to lower costs while meeting the same specifications and requirements. Check it our here: https://us.tecdia.com/casestudies/cost-reductions-through-changing-dispensing-nozzles/

New Rectangular SLC for GaN Applications Case Study

A new case study to share how our new high aspect ratio single layer capacitors can be used to enhance GaN applications has been added to our case study page. Check it our here: https://us.tecdia.com/casestudies/growing-focus-on-revolutionary-gan-technology/

Tecdia Exhibiting at CIOE 2019

From September 4, 2019 until September 7, 2019, Tecdia exhibited at CIOE 2019 (China International Optoelectronic Exposition) in Shenzhen, China. Thank you to those who visited us at booth 1A87-7/1A87-8 to learn more about our advanced ceramic products, thin film circuit technology, precision machining technologies, and custom-order production service. See here for details: http://www.cioe.cn/en/zsml/bull_detail_533.html

New Predeposited AuSn Solder Case Study

A new case study to share our new AuSn solder-ready single layer capacitors has been added to the case study page. Check it our here: https://us.tecdia.com/casestudies/ceramic-capacitor-with-predeposited-solder/

New One-Stop Manufacturing/Assembly Case Study

We have uploaded a new case study to outline our new services combining Tecdia-made electronic components, consigned miscellaneous components and in-house assembly capabilities. Check it our here: https://us.tecdia.com/casestudies/one-stop-manufacturing-assembly-services/

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