Why Tecdia Dispenser Nozzles are Selected for Crystal Quartz Oscillator Manufacturing
Microelectronics Assembly
Ruby Nozzle created for liquid crystal display panel manufacturing to improve coating quality
Microelectronics Assembly
Approximately 120 times longer life cycle achieved by using diamond for a push-up pin tip.
Microelectronics Assembly
Liquid crystal devices are used in vehicles, smartphones and other devices indispensable to our daily lives.
Microelectronics Assembly, Telecommunication (Optical/Wireless/5G/6G)
Camera actuators are indispensable components for smartphone cameras
Microelectronics Assembly
Dispensing is a necessary process in all electronics manufacturing wherein accuracy and precision are of the utmost importance
Microelectronics Assembly
Product innovation: a manual, easy-to-use, highly accurate wafer scribers
Compound Semiconductors, Microelectronics Assembly
Tecdia’s innovative ARQUÉ precision dispensing nozzle is designed to maintain blend consistency and application accuracy.
Microelectronics Assembly
Singulation of soft zinc oxide (ZnO) semiconductor wafers can be a difficult challenge. Tecdia offers solution by creating uniquely-shaped, diamond-tipped scribers.
Compound Semiconductors, Microelectronics Assembly
Silicon carbide wafers are difficult to cut because they are almost as hard as the diamond they are cut with. These wafers are also often brittle and easily chipped without the proper tools. Learn how Tecdia, your scribing specialist, came to the rescue of several semiconductor chip manufacturers.
Compound Semiconductors, Microelectronics Assembly
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