Businesses and universities working with small budgets were unable to purchase expensive machinery to scribe wafers while outsourcing remains to be time-consuming and costly. In the competitive arena of R&D, inexpensive and simple tools are essential. We developed a tool that could accurately scribe GaN, Sapphire and other materials that did not require specialized technology also providing a user-friendly experience.
In order to develop this technology, Tecdia surveyed its customers in order to better understand their scribing needs. Tecdia discovered the following:
In order to address these concerns, Tecdia developed the “Handy Wafer Scriber”. In just 4 simple steps, wafers can be accurately cut by trained professionals or a novice user.
1. Scribe Tool Holder
The scribe tool holder is designed in order to enable user to see where to scribe.
2. “Sandwich” Method
By placing the wafer between the scribing baseplates, the wafer is held still preventing wafer from shifting around.
3. Scribe tool grip improvement
By placing the scribe tool on the cutting point, it is automatically set. The cutting angle is kept consistent.
4. Scribe tool spring
With the addition of the spring, pressure is evenly distributed along the scribe line.
With Tecdia’s advanced diamond scribe tools and precision machining we were able to produce this product in order to meet the needs of our diverse patrons.
Our Handy Wafer Scriber has been used in start-up businesses, world renowned corporations, and universities.
Technological Universities and Laboratories (U.S.A.), R&D Facilities (Spain), Semiconductor Producers & Quality Assurance Departments (Japan & Germany)
Office Hours: 8:30am - 5:30pm PST