Increased demand for InP semiconductors due to the development of 5G
Compound Semiconductors, Telecommunication (Optical/Wireless/5G/6G)
Product innovation: a manual, easy-to-use, highly accurate wafer scribers
Compound Semiconductors, Microelectronics Assembly
Singulation of soft zinc oxide (ZnO) semiconductor wafers can be a difficult challenge. Tecdia offers solution by creating uniquely-shaped, diamond-tipped scribers.
Compound Semiconductors, Microelectronics Assembly
Tecdia’s tool setter jig provides quick and accurate scriber alignment and installation into a scriber machine.
Compound Semiconductors
Silicon carbide wafers are difficult to cut because they are almost as hard as the diamond they are cut with. These wafers are also often brittle and easily chipped without the proper tools. Learn how Tecdia, your scribing specialist, came to the rescue of several semiconductor chip manufacturers.
Compound Semiconductors, Microelectronics Assembly
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