| Trade Name | Tecdia Inc. |
|---|---|
| Address |
2255 S. Bascom Ave., Suite 120, Campbell, CA, 95008, USA
TEL: +1-408-748-0100 FAX: +1-408-748-0111 E-MAIL : sales@tecdia.com URL : https://us.tecdia.com/jp/ |
| Established | 1985 |
| Jun. 1976 | Techtronics Co., Ltd. is established as the successor to Koyama Diamond, Ltd. Manufacturer and exporter of audio products. |
|---|---|
| Sep. 1976 | Diamond processing lab established in Nerima-ku, Tokyo. |
| May 1977 | Achieved technological breakthrough in diamond brazing. |
| Jul. 1978 | Development of high frequency electronics products begins. |
| Sep. 1979 | Commenced sales of high frequency electronics business. |
| Oct. 1979 | Manufacturing branch established in Tokorozawa, Saitama Japan for audio products. |
| Oct. 1979 | Techtronics renamed: Tecdia Company Ltd. Opened a factory in Sakuradai, Nerima-ku Tokyo, Japan for precision instruments production after successful development of diamond scalpels and knives. |
| Apr. 1983 | Tecdia headquarters office moved to in the Sunshine60 skyscraper in Tokyo, Japan. |
| Dec. 1985 | Tecdia Inc. established in Mountain View, California’s Silicon Valley, to develop business previously done through a USA representative. |
| Dec. 1985 | Patent for audio product granted in the US following earlier grant of the same patent in Japan (January, 1982). |
| Jul. 1987 | Sakuradai Factory and the Tokorozawa Factory are combined into one factory in Sayama to meet the needs to the growing company. |
| Jul. 1988 | A Tecdia company is established in Melbourne, Australia to manufacture and sell audio components. |
| Jan. 1990 | Established facility in Saikyo-ku Kyoto, Japan to design and produce ceramic passive components for high frequency electronics. |
| Jun. 1993 | Cebu Microelectronics, Inc (CMI) is founded in the Philippines, Mactan Export Processing Zone to perform contract manufacturing services for Tecdia’s design centers in Japan and other Japanese companies. |
| Nov. 1994 | Microwave Technologies Division established to develop custom components and devices for microwave equipment manufactures. |
| Oct. 1995 | Tecdia begins the development and manufacture of electronics components for fiber optics applications. |
| Sep. 1996 | Constructed a second factory building at CMI’s Cebu location. Expansion enables CMI to manufacture products for Tecdia’s Microwave Technology Division. |
| Jun. 1999 | Fiber optic connector assembly added to Tecdia’s production capabilities. |
| Jun. 2000 | Diamond Product Technology Division is established with an objective to actively enter the wafer scribing market. |
| Nov. 2000 | Tecdia Taiwan sales office is established in Taoyuan to handle the sales of high frequency components. |
| Jan. 2001 | A third factory building is constructed at CMI in Cebu, Philippines. |
| Aug. 2001 | Tecdia Korea sales office is established in Suwon to handle the sales of high frequency components. |
| Dec. 2001 | Relocated factory in Minami-ku Kyoto, Japan to multi-story facility with upgraded, expanded capacity. Changed name to Kyoto Technology Center. |
| Aug. 2003 | Sayama Plant relocated to Musashi Industrial Park in Iruma, Saitama, and begins operation as Tokyo Technical Center. |
| Nov. 2004 | Tecdia Hong Kong is established in Tsim Sha Tsui, Hong Kong as base to actively pursue the Chinese market. |
| Dec. 2004 | CMI obtains ISO9001:2000 certification. |
| Dec. 2005 | CMI obtains ISO14001:2004 Certification. |
| Jan. 2006 | Corporate headquarters, Kyoto Technology Center, and Tokyo Technical Center obtain ISO14001:2004 Certification. |
| Sep. 2006 | New building is constructed at Tokyo Technical Center to handle growing business. |
| Nov. 2006 | Hong Kong office is relocated to Shanghai, China to function as the company’s representative under the name Tecdia Shanghai Representative Office to become the base for business in China. |
| Jul. 2007 | A fourth facility is added to CMI’s plant location in Export Processing Zone in Cebu, Philippines to handle growing business. |
| Oct. 2008 | Additional new building is constructed at Tokyo Technical Center to handle growing business. |
| Feb. 2011 | Shanghai Representative Office is converted to a local subsidiary under the name Tecdia Shanghai. |
| Jun. 2013 | Tecdia Headquarters office is moved to Minato-ku, Tokyo, Japan, consolidating all 3 sites in Japan. |
| Nov. 2013 | To meet growing business, Tecdia Taiwan is relocated to New Taipei City. |
| Jun. 2014 | Tecdia Inc. (USA) relocated to Campbell, CA in Silicon Valley. |
| Nov. 2014 | Tecdia Inc. opens new branch office in Europe. |
| Nov. 2015 | Tecdia Shanghai relocated to current address to handle growing business. |
| Feb. 2020 | Tecdia Shenzhen office launched in strategically selected location close to the booming semiconductor components hub of China. |
| Apr. 2022 | CEBU MICROELECTRONICS INC. (CMI) is rebranded as TECDIA CEBU, INC. |
Japan Tokyo Head Quarter
Taiwan TECDIA Taiwan
USA TECDIA U.S.A
USA Sertech Inc
USA Spartech
UK TECDIA Inc. Europe Branch
Korea TECDIA Korea
Russia IM LLC
China TECDIA Shanghai
China TECDIA Shenzhen
Israel Impact Electronics Ltd.
Philippines TECDIA Cebu
+1-408-748-0100
Office Hours: 8:30am - 5:30pm PST
