Integrating a resistor into the top electrode of a capacitor to achieve space-savings within highly integrated devices while contributing to improved tact time by having one less part to place.
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Depending on the ceramic dielectric used and electrode configuration, we use different metal stacks to achieve best mechanical and electrical performances. The different stacks we may use are as follows.
Top |
TaN – TiW – Au |
Bottom |
Ti – Pt – Au |
Table cells can be clicked to reveal applicable part numbers and a link to the spec sheet for details. The different colors represent the different dielectric material used as below.
Thickness: 10 mils ± 1 mil (0.250 mm ± 0.025 mm)
Size L×W |
mils | 25 × 25 | 30 × 30 | 35 × 35 | 40 × 40 | 40 × 30 | 40 × 35 |
---|---|---|---|---|---|---|---|
Tol. | ± 5 | ± 5 | ± 5 | ± 5 | ± 5 | ± 5 | |
mm | 0.63×0.63 | 0.76×0.76 | 0.88×0.88 | 1.00×1.00 | 1.00×0.76 | 1.00×0.88 | |
Tol. | ± 0.13 | ± 0.13 | ± 0.13 | ± 0.13 | ± 0.13 | ± 0.13 | |
Cap.(pF) | Cap. Code | Resistance Options | |||||
220 | 221 | ||||||
270 | 271 | * | |||||
330 | 331 | ||||||
390 | 391 | ||||||
470 | 471 | ||||||
560 | 561 | * | |||||
680 | 681 | * | |||||
Res. (Ω) | EIA Code | ||||||
50 | 500 | ||||||
100 | 101 | ||||||
200 | 201 |
*V tolerance for capacitance is not available.
Dielectric | K = 16,000 |
Rated Working Voltage | 100V |
*This is the rated voltage for the capacitor section.
Temperature Coefficient of Resistance (TCR)
-100 ± 50 ppm / °C (@ – 55 °C to + 85 °C )
Resistor Rated Power
50Ω:
100 mW (@ ≤ 70 °C)
70 mW (@ 70℃ to 85 °C)
100/200Ω:
50 mW (@ ≤ 70 °C)
35 mW (@ 70℃ to 85 °C)
Heat Resistance
320C x 5 min Max in N2 gas environment
Here our ceramic products can be searched to find a part number that satisfies your desired specifications. Select the desired product from the tabls below and parametrically search for your specifications.
Spec sheets can be downloaded from the search results.
Dielectric constants 40 to 50,000 available in three configurations for solder or epoxy die attachment.
Product Details:Single Layer Chip Capacitors [Type A]*Ranges can be dragged and selected.
Hi-K capacitors available in a 2,3 or 4 pad arrays. Sharing common backside metalization, this configuration provides space and cost savings.
Wirebondable single layer thin film resistors suitable for both AuSn and epoxy die attachment. Available in sizes from 16 x 16 mils with power handling up to 100mW.
Rectangular capacitors for applications demanding high aspect ratio caps, such as for GaN impedance matching.
*Ranges can be dragged and selected.
Integrates a resistor into the top electrode of a capacitor to achieve space-savings within highly integrated devices while contributing to improved tact time by having one less part to place.
Binary capacitors are ideal for tuning exact capacitance values for the absolute best performance.
*Ranges can be dragged and selected.
Gap capacitors eliminate the need for wire-bonds by enabling SMD type die attach processes.
*Ranges can be dragged and selected.
Ceramic Ground Blocks are customizable conductive shims ideal for application within micro-assemblies in both optical and microwave industries.
*Ranges can be dragged and selected.
Part Number | Spec | Capacitance (pF) | Cap. Tol. | Size (mil/mm) | Size Tol. (mil/mm) | Thickness (mil/mm) | Thickness Tol. (mil/mm) | Rated Voltage | Type | Temp. Coeff. |
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