Ground Block
Ceramic Ground Blocks are customizable conductive shims ideal for application within micro-assemblies in both optical and microwave industries.
Our ground blocks follow a different part numbering scheme from standard square type. Each part of the PN is structured as follows.
The electrode stackup we use for Ground Blocks is as follows.
Top |
Ti – Pt – Au |
Bottom |
Ti – Pt – Au |
The following table shows a list of standard sized ground blocks we try to keep in stock for generic applications or initial evaluations.
| Part Number | Size (mils) L × W × t |
Size (mm) L × W × t |
| TGB025013015 | 10 × 5 × 6 | 0.25 × 0.13 × 0.15 |
| TGB025025015 | 10 × 10 × 6 | 0.25 × 0.25 × 0.15 |
| TGB025013025 | 10 × 5 × 10 | 0.25 × 0.13 × 0.25 |
| TGB025025025 | 10 × 10 × 10 | 0.25 × 0.25 × 0.25 |
| TGB050013015 | 20 × 5 × 6 | 0.50 × 0.13 × 0.15 |
| TGB050025015 | 20 × 10 × 6 | 0.50 × 0.25 × 0.15 |
| TGB050050015 | 20 × 20 × 6 | 0.50 × 0.50 × 0.15 |
| TGB050013025 | 20 × 5 × 10 | 0.50 × 0.13 × 0.25 |
| TGB050025025 | 20 × 10 × 10 | 0.50 × 0.25 × 0.25 |
| TGB050050025 | 20 × 20 × 10 | 0.50 × 0.50 × 0.25 |
Dimensions are specified as L x W x H. L x W dimensions have a tolerance of 50 um (2 mils) and H dimension has a tolerance of 25 um (1 mil).
Please contact us for other sizes and metallization schemes.
Note: If you have custom specifications you wish to satisfy then Tecdia can tailor the dimensions, dielectric constant, capacitance, TC and other options to match target capacitance options desired. For immediate assistance just give us a call at 408-748-0100 (USA) or contact us electronically using our contact form, tell us your requirements and we will find you the perfect part for you.
Here our ceramic products can be searched to find a part number that satisfies your desired specifications. Select the desired product from the tabls below and parametrically search for your specifications.
Spec sheets can be downloaded from the search results.
Dielectric constants 40 to 50,000 available in three configurations for solder or epoxy die attachment.
Product Details：Single Layer Chip Capacitors [Type A]*Ranges can be dragged and selected.
Hi-K capacitors available in a 2,3 or 4 pad arrays. Sharing common backside metalization, this configuration provides space and cost savings.
Wirebondable single layer thin film resistors suitable for both AuSn and epoxy die attachment. Available in sizes from 16 x 16 mils with power handling up to 100mW.
Rectangular capacitors for applications demanding high aspect ratio caps, such as for GaN impedance matching.
*Ranges can be dragged and selected.
Integrates a resistor into the top electrode of a capacitor to achieve space-savings within highly integrated devices while contributing to improved tact time by having one less part to place.
Binary capacitors are ideal for tuning exact capacitance values for the absolute best performance.
*Ranges can be dragged and selected.
Gap capacitors eliminate the need for wire-bonds by enabling SMD type die attach processes.
*Ranges can be dragged and selected.
Ceramic Ground Blocks are customizable conductive shims ideal for application within micro-assemblies in both optical and microwave industries.
*Ranges can be dragged and selected.
| Part Number | Spec | Capacitance (pF) | Cap. Tol. | Size (mil/mm) | Size Tol. (mil/mm) | Thickness (mil/mm) | Thickness Tol. (mil/mm) | Rated Voltage | Type | Temp. Coeff. |
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