Gap Capacitors
*Typical resonant frequency data from application notes does not apply to this product series.
Our gap capacitors follow a different part numbering scheme from standard square type. Each part of the PN is structured as follows.
Depending on the ceramic dielectric used and electrode configuration, we use different metal stacks to achieve best mechanical and electrical performances. The different stacks we may use are as follows.
Top |
TiW – Au, TaN – TiW – Au |
Bottom |
TiW – Pt – Au, TaN – TiW – Pt – Au, TiW – Au, TaN – TiW – Au |
| Part Number | Capacitance Code of Each Pad | Capacitance Mounted (pF) | Size (mils) L × W |
Size (mm) L × W |
Dielectric |
| AMG0R5B1AG | 0R5 | 0.25 | 12 × 24 | 0.3 × 0.6 | K = 140 |
| BMG0R5B1AG | 0R5 | 0.25 | 12 × 24 | 0.3 × 0.6 | K = 140 |
| AMG5R0K2AG | 5R0 | 2.5 | 12 × 24 | 0.3 × 0.6 | K = 1,600 |
| BMG5R0K2AG | 5R0 | 2.5 | 12 × 24 | 0.3 × 0.6 | K = 1,600 |
| AMG150K2BG | 150 | 7.5 | 20 × 33 | 0.5 × 0.85 | K = 1,600 |
| BMG150K2BG | 150 | 7.5 | 20 × 33 | 0.5 × 0.85 | K = 1,600 |
| AMG250K2BG | 250 | 12.5 | 20 × 33 | 0.5 × 0.85 | K = 2,800 |
| BMG250K2BG | 250 | 12.5 | 20 × 33 | 0.5 × 0.85 | K = 2,800 |
Note: If you have custom specifications you wish to satisfy then Tecdia can tailor the dimensions, dielectric constant, capacitance, TC and other options to match target capacitance options desired. For immediate assistance just give us a call at 408-748-0100 (USA) or contact us electronically using our contact form, tell us your requirements and we will find you the perfect part for you.
Here our ceramic products can be searched to find a part number that satisfies your desired specifications. Select the desired product from the tabls below and parametrically search for your specifications.
Spec sheets can be downloaded from the search results.
Dielectric constants 40 to 50,000 available in three configurations for solder or epoxy die attachment.
Product Details：Single Layer Chip Capacitors [Type A]*Ranges can be dragged and selected.
Hi-K capacitors available in a 2,3 or 4 pad arrays. Sharing common backside metalization, this configuration provides space and cost savings.
Wirebondable single layer thin film resistors suitable for both AuSn and epoxy die attachment. Available in sizes from 16 x 16 mils with power handling up to 100mW.
Rectangular capacitors for applications demanding high aspect ratio caps, such as for GaN impedance matching.
*Ranges can be dragged and selected.
Integrates a resistor into the top electrode of a capacitor to achieve space-savings within highly integrated devices while contributing to improved tact time by having one less part to place.
Binary capacitors are ideal for tuning exact capacitance values for the absolute best performance.
*Ranges can be dragged and selected.
Gap capacitors eliminate the need for wire-bonds by enabling SMD type die attach processes.
*Ranges can be dragged and selected.
Ceramic Ground Blocks are customizable conductive shims ideal for application within micro-assemblies in both optical and microwave industries.
*Ranges can be dragged and selected.
| Part Number | Spec | Capacitance (pF) | Cap. Tol. | Size (mil/mm) | Size Tol. (mil/mm) | Thickness (mil/mm) | Thickness Tol. (mil/mm) | Rated Voltage | Type | Temp. Coeff. |
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