Thin Film Substrates


Design Features


Design Guide Downloads:

USA Facility Design Guide

Philippines Facility Design Guide

Inspection Standards

・Suitable for a wide range of applications for civil and aerospace systems.
・Inspection method grades are classified into three types: standard, commercial, and custom.
・Mechanical and electrical characteristics are inspected by sampling for each lot, and visual inspection is performed on all products.


Standard Inspection


Inspection Item Inspection Quantity Allowable number of Defects
Visual Inspection Inspection Lot AQL II(1.0%) Inspection Lot AQL II(1.0%)
Dimension measurement 3 pcs per Wafer Lot 0

Other inspections vary depending on the design, so please contact us if you have any questions.


Other Testing Capabilities


Item Test Conditions
temperature cycle MIL-STD-883 / Method 1010 Cond. A / B / C
Thermal Shock MIL-STD-202 / Method 107 Cond. A / B / F
Die Shear Strength MIL-STD-883 / Method 2019
Vibration MIL-STD-202 / Method 201
High Frequency Vibration MIL-STD-202 / Method 204 Cond. A / D
Variable Vibration MIL-STD-883 / Method 2007 Cond. A




Unit Alumina(Al2O3) Aluminum Nitride(AlN)
99.6%(Standard) 170W/mK(Standard)
Thickness mm 0.254 / 0.381 / 0.508 / 0.635
(Min: 0.10 Max: 1.30)
Thickness Tolerance mm 0.013
Size Maximum mm 10.0 × 10.0
Minimum mm 0.25 × 0.25
Surface Roughness Surface Ra μm (μ”) Polish 0.025 (0.001) Polish 0.051 (0.002)
Backside Ra μm (μ”) Polish 0.025 (0.001) Polish 0.051 (0.002)
Film Composition Electrode Film Ti – Pt – Au
Film Thickness Standard μm Au: 0.10 – 5.00
Pt: 0.15
Ti: 0.06
Au: 0.10 – 3.00
Pt: 0.15
Ti: 0.06
Resistance Resistive Film Tantalum Nitride (TaN)
Sheet Resistance Ω/sq 25 / 50 / 75 / 100
Temperature Characteristics ppm/℃ -100 ± 50
AuSn Composition Ratio % Au : Sn = 80 : 20 (Nominal)
Thickness μm 3.00 – 7.00
Line and Space mm Standard 0.025 / 0.025  Minimum 0.01 / 0.01
Set Back mm Standard 0.03

*Please contact us for other materials such as dielectrics, ferrite, quartz, etc.
*Please contact us for other specifications.


Material Properties


Alumina Substrate


Item Unit Specification
Tone White
Content* % 99.6
Density g/㎝2 3.88
Thermal Conductivity W/m・K 26.9
Thermal Expansion Coefficient X10-6 /℃ 25 ~ 300℃ : 7
25 ~ 600℃ : 7.2
Permittivity ε @1MHz 9.9
Dielectric Loss @1MHz 0.0001
Volume Resistance Ω・cm 25℃ : >1.0×1014
100℃ : >1.0×1014
300℃ : >1.0×1014


Aluminum Nitride Substrate


Item Unit Specification
Tone Gray
Density g/㎝2 3.3
Thermal Conductivity W/m・K 170
Thermal Expansion Coefficient X10-6 /℃ 25 ~ 500℃ : 4.6
Permittivity ε @1MHz 8.8
Dielectric Loss @1MHz 0.0001
Volume Resistance Ω・cm 25℃ : >1.0×1014


Packaging & Environmental Compliance




If you have a specific packing method that you would prefer to use, please let us know.


Material Color Size
Waffle pack ABS White / Natural 2inch / 4inch
Waffle pack* Anti Static Black 2inch / 4inch

*Please contact us for the pocket size of the tray.


Environmental Compliance


Product: European RoHS directive compliant
Packaging materials: Conforms to European directives on containers and packaging and waste containers and packaging




Performance Guarantee Liability Period 1 Year after Delivery
Storage Conditions* Waffle Pack Temperature +13℃~ +33℃ Humidity 60%RH or less
Blue Tape(UV tape excluded) Temperature +20℃~ +26℃ Humidity 60%RH or less

*Avoid storage under normal pressure, direct sunlight, vibration, impact, corrosive gas atmosphere, other special gases, freezing, condensation, and dusty environments.
Also, do not touch the product directly with bare hands.


Recommended conditions


 Die Attach Conditions


When mounting, be careful not to short-circuit the sides due to overfilling the adhesive.
Also, cracks depend on the mounting conditions, so we recommend that you check them under your own conditions.


Recommended conditions for wire bonding


・Wire Type less than Φ30um of Au wire
・Bonding Temperature (Supplementary Matter) Wedge Bonding: 200~270℃
Ball Bonding: 150~250℃
It is recommended to use tool heating together.
・Bonding Method Thermocompression or ultrasonic thermocompression
・Notes Bond at a distance of 25um or more from the electrode end.
In addition, if the bonding acceleration is large with hard wire, the surface of the ceramic material will be damaged. it may cause electrode peeling, so we recommend checkingand adjusting according to the mounting conditions.


Related Sites

Case Studies Page: NASA Chooses Tecdia for Precision TaN Circuits


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