Businesses and universities working with small budgets were unable to purchase expensive machinery to scribe wafers while outsourcing remains to be time-consuming and costly. In the competitive arena of R&D, inexpensive and simple tools are essential. We developed a tool that could accurately scribe GaN, Sapphire and other materials that did not require specialized technology also providing a user-friendly experience.

In order to develop this technology, Tecdia surveyed its customers in order to better understand their scribing needs. Tecdia discovered the following:

1. It is difficult to see the scribing area with precision
2. The wafer is difficult to stabilize during scribing
3. It is difficult to maintain the correct angle of the diamond cutting surface during scribing
4. Maintaining consistent pressure was problematic

In order to address these concerns, Tecdia developed the “Handy Wafer Scriber”. In just 4 simple steps, wafers can be accurately cut by trained professionals or a novice user.

Our Handy Wafer Scriber has been used in start-up businesses, world renowned corporations, and universities.