Features
- ISO9001, ISO14001, and ISO13485 Certified.
- We manufacture capacitors and custom substrates
- In-house jig design and manufacturing
- Parts procurement agent
- Operation in English and Japanese
- Support from process start-up to mass production
Available equipment
- Manual Pin Set Bonder
- Automatic Wire Bonder
- Manual Wire Bonders (Wedge, Ball)
- Cap Sealing Equipment
- Laser Marking Equipment
- Bubble Leak Detector
- Helium Leak Detector
- Helium Pressurizer
- PIND Tester
- Thermal Shock Testing Equipment
- YAG Self-Aligning Welder
- Dispensing Equipment
- Wire Pull and Die Shear Strength Testers
- LD Die Bonder (Semi-Automatic)
- And More
Application Examples
Products for microwave communications
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Die Bonding
– Epoxy Bonding (Conductive / Non Conductive)
– Eutectic Bonding
– Wire Bonding
– Au wire (Ball Wedge)
– Au Ribbon
– Soldering |
Product Performance
・PCBA Assembly
・Reader Module
・DC Board
・PC Board
・Bias T
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・Micro wave amplifier
・GaAs FET assembly
・GaN FET assembly
・MMIC assembly |
Products for optical communication
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– Die Bonding
– Epoxy Bonding (Conductive/ Non Conductive)
– Eutectic Bonding
– Wire Bonding
– Soldering
– Resistance Welding
– Lid Sealing
– Cap Sealing
– YAG Welding
– He Leak Test
– Alignment (Active Alignment method) |
Product Performance
・25G TOSA (Butterfly Package)
・25G ROSA (TO-CAN)
・SFP+ TOSA (Butterfly Package)
・SFP+ ROSA (Butterfly Package)
・Tunable TOSA (Butterfly Package)
・10G TOSA (TO-CAN)
・10G ROSA (TO-CAN)
・10G TOSA (Cool-CAN)
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・1.25G SFP (Pluggable Type)
・2.5G SFP (Pluggable Type)
・1.25G CSFP
・2.5G BIDI-SFP
・1.25G BIDI (Pigtail Type)
・1.25G SFF Module
・QSFP28 ROSA Sub Assembly |
+1-408-748-0100
