Ceramic Products Precision Machined Tools Diamond Products Microelectronic Assemblies

Ceramic Products


What capacitor is the best for the capacitance I need?

Choosing the best capacitor for any given application depends on many factors other than its nominal capacitance value. Often it is necessary to balance different characteristics to achieve the all around best choice. Tecdia specializes in single layer ceramic chip capacitors used in microelectronic circuits for high frequency applications and in photonics. We have a very large selection of capacitor products that cover the full spectrum of features you may need to consider, e.g. electrical, environmental, mechanical, installation, and cost. We can provide the information you need and samples to try.
The key factors that affect cost are: design style, size, capacitance tolerance, screening, and purchase quantity. Other factors that can affect cost are packaging, custom specifications, non-standard processing, to name a few. Our sales staff can assist you in getting the best value for your needs.
Tecdia's standard lead time is 4 - 6 Weeks. Our single layer capacitors are made by dicing metalized ceramic wafers. The yield per wafer depends on a variety of factors and can range from less than 100 to thousands. Depending on certain factors, lead time can vary due to the availability of diced parts, wafers available for dicing, order volume, and screening requirements. Tecdia provides a variety of supply plans, including VMI, that enable customers to have parts when they need them.
Yes we can.
We can handle metallization and high accuracy patterning, depending on the dielectric material used and intended use. There are certain limitations to size, thickness, etc., so we will work with you to discuss and decide the specifications that will be best for you. For certain custom designs we may request that you include a drawing showing specifications and digital data (Dxf or Dwg).
We collect reliability data on a continual basis for the ceramic dielectric material we use to make capacitors. We also retain for specified periods test and measurement data routinely recorded during product production and screening. High frequency characteristics, S-parameter data, and other characteristics can be produced on request for specific products. We have a well equipped test lab that is capable of performing the most popular requirements, including space qualification.
Our standard warranty for serviceability is one year from the date of delivery on condition the parts are properly protected before use and not damaged by installation or operation. Quality standards will depend upon the grade level of product ordered.
We do not.
There are major differences in the technologies and manufacturing processes for multi-layer (or embedded single layer) and conventional single layer capacitors. It is very important to understand these differences when evaluating screening and application requirements. Tecdia is a full service manufacturer of ceramic wafers from powder mixing to grinding and polishing. And we use those wafers, as well as purchased ones, to produce various types of products, including capacitors, using our thin film metallization processes.
We pride ourselves in our customer service and our strict quality control. With more than 40 years of manufacturying experience we offer our customers expert advice and our quality is based on strict quality guidlines developed from our Japan Headquarters.

Precision Machined Products

ARQUE Series


What is the lead time?

In-stock products can be delivered roughly one week after an order is placed.
For custom and out-of-stock items, please allow 4-12 weeks delivery time depending on available production capacity.
There is no minimum order quantity (MOQ) for ARQUE, ARQUE Premium, Ruby Nozzles, or Super Long-Tipped Nozzles, whereas there is an MOQ of 150 pieces for ARQUE Select nozzles and 10 pieces for custom parts.
Our main series nozzles are manufactured using stainless steel (SUS303). For custom parts, available materials include, but are not limited to, hardened steel, brass, and other types of stainless steel.
We can fully customize your order to any inner and outer diameters.
There are, however, limitations on tip thickness, so be sure to consult with us in advance.
Yes, contact us for the different types of available coatings, including Aegis Coatings.
We make fixtures only to go with Tecdia-made nozzles.
We have so far achieved diameter sizes down to 30μm at production scales using SUS303.
*However, please contact us for details as there are limitations on use at smallers sizes.
We do. Please visit this website to purchase.



What is the lead time?

In-stock products can be delivered roughly one week after order is placed. For custom and out-of-stock items, please allow 4-12 weeks delivery time depending on available production capacity.
The minimum order quantity for needles is 10 pieces.
Available materials are tungsten carbide, HSS, palladium alloy, and metal with diamond tip.
The smallest is φ0.4 mm.

Diamond Products


What are diamond scribers?

Diamond scribe tools are specialized cutting tools for use in wafer scribing (both hand scribing and with machines). These tools make cuts on semiconductor wafers as part of what is known as the wafer dicing process and are used to help convert the wafer into chips. These tools are mounted with specially shaped diamonds at their tips that enable them to make cuts in the hard materials that wafers are made from.
Scribing is a material fracturing process where cuts are used to initiate a controlled crack along which the material will break under applied pressure. Each type of scribe tool is designed for specific types of wafer materials and characteristics. It is very important to use the correct type of scribe tool in order to create the necessary stress for cracking while avoiding damage to the products (e.g. number of scribe points, heel vs toe type, etc).
Scribing is a dry-cutting process that avoids heat from high friction (in contrast to diamond sawing) and also avoids melting (in constrast to laser cutting). As such, diamond scribing does not require a coolant and avoids any potential damage due to heat. The wafer cross-section created at the break lines have a mirror-like finish, which makes this method especially ideal for singulation operations for die used in light-emitting devices. It also makes quick cuts as the width of each scribe line is only a few microns.
Using our Scribe Tool Selection Guide, you can choose the best scribe tool for your project based on wafer material, wafer thickness, and other characteristics. Our team of expereienced engineers can also help decide which choice is best for you, so please contact us for assistance!.
Yes. Unfortunately, even diamonds with their famous ultra-durability do eventually wear out with prolonged use. However, the craftmanship of our scribe tools allows for a market-leading lifespan that can't be found using cheaper alternatives.
The maximum wafer diameter that can be used in conjunction with the guide lines on the Handy Wafer Scriber is 3 inches (76.2mm). Larger wafer sizes can still be used but will extend past the guides.

Contract Manufacturing


Where do you carry out contract production?

Manufacturing takes place at our production facility in Cebu, Philippines, TECDIA Cebu, Inc..
We support many different kinds of projects, with recent examples ranging from electronic component circuit board mounting to assembly of semiconductor devices and transceivers for optical communication. We support both prototype and mass production phase projects, so please contact us to get your project off the ground today!


Office Hours: 8:30am - 5:30pm PST