News

Tecdia will be exhibiting at “IME Shanghai” to be held in Shanghai, China from Wednesday, October 23rd to Friday, October 25th, 2024. We will be exhibiting our main products, such as single-layer ceramic capacitors. (Booth number: 752)

Tecdia will be exhibiting at the 24th Business Fair to be held at Shibuya Hikarie on Tuesday, November 12, 2024. (Booth number: B-24)

We will be exhibiting at ‘CIOE 2024,’ which will be held in Shenzhen, China, from Wednesday, September 11 to Friday, September 13, 2024. We will be showcasing our key product, the single-layer ceramic capacitor, along with our precision nozzle ‘kaika’ for 3D printers. (Booth numbers: 12B758, 12B759, 12B760)

Some exciting news for Tecdia, we will be updating our office locations!

Below are the details of address change and effective dates.

Tecdia Inc. California office address will be changed as follows:

Effective Friday, May 24, 2024 :
From: 2255 S. Bascom Ave., Suite 120, Campbell, CA, 95008.
To: 490 Jarvis Drive, Suite 12B-1, Morgan Hill, CA, 95037.

Tecdia Co. Ltd. Japan office address will also be changed as follows:

Effective Monday, May 27, 2024 :
From: 2F, Tamachi Kiyota Building, 4-3-4 Shibaura, Minato-ku, Tokyo, 108-0023, Japan.
To: 17F, Shibaura Square Building , 4-9-25 Shibaura, Minato-ku, Tokyo, 108-0023, Japan.

Tecdia Shenzen office address will also be changed as follows:
From: Room 312, 3rd floor, Deweisen Building, Gaoxin South 7th, Nanshan District, Shenzen
To: Xinggang Tongchuanghui Room 508, Yuheng Building 3, No. 6099 Fuhai Road, Baoan District, Shenzhen 518103

If you have any further questions regarding the change of our address,
please feel free to contact us at sales@tecdia.com.