Case Studies

Latest News

  • Tecdia Exhibiting at OFC 2018

    March 13-15, Tecdia will be exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) show in San Diego, CA. This year we will be showcasing our latest ceramic products, thin film substrate line and contract manufacturing/micro-assembly services. Please visit us in booth 4731!

    Friday February 16, 2018
  • Wafer Processing Equipment Business Division Transfer

    We are pleased to announce that we have transferred our Wafer Processing Equipment Business Division to our company Kumasan Medix Co., Ltd. as described below.
    For details, click here.

    Date of business transfer agreement conclusion: December 13 2017
    Business transfer date: January 31 2018

    Thursday December 21, 2017
  • Tecdia Exhibiting at 2017 European Microwave Week

    October 10-12, Tecdia exhibited at the 2017 European Microwave Week Exhibition in Nuremburg, Germany at booth 143. Thank you to all that stopped by and asked us about our single layer capacitors (with new backside AuSn!and the latest capabilities of our HCT alumina/aluminum nitride substrate line.

    Tuesday September 26, 2017