Case Studies

Latest News

  • Tecdia Exhibiting at EDICON 2017

    April 25-27, Tecdia will be exhibiting at the Electronic Design Innovation Conference (EDICON 2017) at the Shanghai Convention & Exhibition Center of International Sourcing in China at booth 113. We will be showcasing our single layer ceramic capacitors and alumina thin film circuit boards in addition to introducing our ceramic circuit production technologies (HCT – Hybrid Ceramic Technologies).
    http://www.ediconchina.com/

    Friday March 3, 2017
  • Tecdia Exhibiting at OFC 2017

    March 21-23, Tecdia will be exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) show in Los Angeles, CA. This year we will be showcasing the latest in high performance Lightwave submount design with fine patterning and 3D shapes. Please visit us in booth 1940!
    http://www.ofcconference.org/en-us/home/

    Tuesday January 31, 2017
  • New Ground Block Case Study

    We have added a case study about Tecdia’s new Ground Block to our case study library to share a little information on the origins of the Ground Block.
    http://us.tecdia.com/casestudies/ground-block-using-conductive-ceramic/

    Tuesday December 13, 2016