April 24th, 2019
June 4-6, Tecdia will be exhibiting at the International Microwave Symposium (IMS) show in Boston, MA. This year we will be showcasing not only our traditional ceramic products, such as single layer capacitors, chip resistors and thin film substrates, but will also have a live demo of our upcoming high performance ceramic varactor for 5G and mmWave frequencies. Please check the demo out at booth 860! https://ims-ieee.org/
March 21st, 2019
We have uploaded a new case study to outline our new services combining Tecdia-made electronic components, consigned miscellaneous components and in-house assembly capabilities. Check it our here: http://us.tecdia.com/casestudies/one-stop-manufacturing-assembly-services/
January 25th, 2019
March 5-7, Tecdia will be exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) show in San Diego, CA. This year we will be showcasing the latest in optical sub-assembly and thin film ceramic capacitors and resistors. Please visit us in booth 4226!
November 8th, 2018
We have uploaded a new case study to showcase the latest in Tecdia ingenuity… helping out the medical and medicinal industry with a new low-cost, high quality microneedle. Check it our here: http://us.tecdia.com/casestudies/medical-microneedles/
August 20th, 2018
We have created a new product page to describe our newly released line of completely customizable diamond pickup tools. See it here: http://us.tecdia.com/products-services/diamond-products-overview/diamond-pickup-tools/
July 31st, 2018
We have uploaded a new case study to showcase the latest in Tecdia ingenuity… helping out the automotive liquid crystal industry with a new low-cost, durable diamond pickup tool. Check it our here: http://us.tecdia.com/casestudies/diamond-pickup-tool/
April 18th, 2018
We have uploaded a new case study showcase the latest in Tecdia nozzle capabilities. Check it our here: http://us.tecdia.com/casestudies/super-long-tipped-nozzles/
February 16th, 2018
March 13-15, Tecdia will be exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) show in San Diego, CA. This year we will be showcasing our latest ceramic products, thin film substrate line and contract manufacturing/micro-assembly services. Please visit us in booth 4731!
December 21st, 2017
We are pleased to announce that we have transferred our Wafer Processing Equipment Business Division to our company Kumasan Medix Co., Ltd. as described below.
For details, click here.
Date of business transfer agreement conclusion: December 13 2017
Business transfer date: January 31 2018
September 26th, 2017
October 10-12, Tecdia exhibited at the 2017 European Microwave Week Exhibition in Nuremburg, Germany at booth 143. Thank you to all that stopped by and asked us about our single layer capacitors (with new backside AuSn!and the latest capabilities of our HCT alumina/aluminum nitride substrate line.