April 24th, 2017
June 6-8, Tecdia will be exhibiting at the 2017 MTTS International Microwave Symposium in Honolulu, Hawaii at booth 708. Stop by and ask us about our single layer capacitors and the latest capabilities of our HCT alumina/aluminum nitride substrate line.
March 3rd, 2017
April 25-27, Tecdia will be exhibiting at the Electronic Design Innovation Conference (EDICON 2017) at the Shanghai Convention & Exhibition Center of International Sourcing in China at booth 113. We will be showcasing our single layer ceramic capacitors and alumina thin film circuit boards in addition to introducing our ceramic circuit production technologies (HCT – Hybrid Ceramic Technologies).
January 31st, 2017
March 21-23, Tecdia will be exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) show in Los Angeles, CA. This year we will be showcasing the latest in high performance Lightwave submount design with fine patterning and 3D shapes. Please visit us in booth 1940!
December 13th, 2016
We have added a case study about Tecdia’s new Ground Block to our case study library to share a little information on the origins of the Ground Block.
November 9th, 2016
We have added a listing describing our new conductive ceramic Ground Blocks to the ceramic products overview page.
November 8th, 2016
We have added our new K=50,000 dielectric single layer capacitor series to our ALTAS® Ultra High-K ceramic capacitor page.
September 6th, 2016
We have launched a new website especially for the expanding Indian market that emphasizes our range of Ceramic Products.
June 24th, 2016
August 24-26, Tecdia will be exhibiting at the Int’l Smart Display & Touch Panel Exhibition 2016 at Nangang Exhibition Hall in Taipei, Taiwan at booth N527. We will be showcasing various precision nozzles, including our versatile dispenser Verdis nozzle line.
April 13th, 2016
May 24-26, Tecdia will be exhibiting at the 2016 MTTS International Microwave Symposium in San Francisco, California at booth 1848. We will be showcasing Thin Film Ceramic Components and our HCT Substrate line for Transistor Packages.
February 9th, 2016
March 22-24, Tecdia will be exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) show in Anaheim, CA. This year we will be showcasing the latest in high performance Lightwave submount design with fine patterning and 3D shapes. Please visit us in booth 2343!