News Archives

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    • Comments Off on New Medical Microneedle Case Study

    We have uploaded a new case study to showcase the latest in Tecdia ingenuity… helping out the medical and medicinal industry with a new low-cost, high quality microneedle. Check it our here: http://us.tecdia.com/casestudies/medical-microneedles/

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    • Comments Off on Diamond Pickup Tool Product Page Added

    We have created a new product page to describe our newly released line of completely customizable diamond pickup tools. See it here: http://us.tecdia.com/products-services/diamond-products-overview/diamond-pickup-tools/

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    • Comments Off on New Diamond Pickup Tool Case Study

    We have uploaded a new case study to showcase the latest in Tecdia ingenuity… helping out the automotive liquid crystal industry with a new low-cost, durable diamond pickup tool. Check it our here: http://us.tecdia.com/casestudies/diamond-pickup-tool/

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    • Comments Off on New Super-Long Tipped Nozzle Case Study

    We have uploaded a new case study showcase the latest in Tecdia nozzle capabilities. Check it our here: http://us.tecdia.com/casestudies/super-long-tipped-nozzles/

    Tecdia Exhibiting at OFC 2018

    February 16th, 2018

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    March 13-15, Tecdia will be exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) show in San Diego, CA. This year we will be showcasing our latest ceramic products, thin film substrate line and contract manufacturing/micro-assembly services. Please visit us in booth 4731!
    http://www.ofcconference.org/en-us/home/

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    • Comments Off on Wafer Processing Equipment Business Division Transfer

    We are pleased to announce that we have transferred our Wafer Processing Equipment Business Division to our company Kumasan Medix Co., Ltd. as described below.
    For details, click here.

    Date of business transfer agreement conclusion: December 13 2017
    Business transfer date: January 31 2018

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    • Comments Off on Tecdia Exhibiting at 2017 European Microwave Week

    October 10-12, Tecdia exhibited at the 2017 European Microwave Week Exhibition in Nuremburg, Germany at booth 143. Thank you to all that stopped by and asked us about our single layer capacitors (with new backside AuSn!and the latest capabilities of our HCT alumina/aluminum nitride substrate line.
    http://www.eumweek.com/

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    • Comments Off on Tecdia Exhibiting at 2017 MTTS International Microwave Symposium

    June 6-8, Tecdia will be exhibiting at the 2017 MTTS International Microwave Symposium in Honolulu, Hawaii at booth 708. Stop by and ask us about our single layer capacitors and the latest capabilities of our HCT alumina/aluminum nitride substrate line.
    http://www.ims2017.org/

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    • Comments Off on Tecdia Exhibiting at EDICON 2017

    April 25-27, Tecdia will be exhibiting at the Electronic Design Innovation Conference (EDICON 2017) at the Shanghai Convention & Exhibition Center of International Sourcing in China at booth 113. We will be showcasing our single layer ceramic capacitors and alumina thin film circuit boards in addition to introducing our ceramic circuit production technologies (HCT – Hybrid Ceramic Technologies).
    http://www.ediconchina.com/

    Tecdia Exhibiting at OFC 2017

    January 31st, 2017

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    March 21-23, Tecdia will be exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) show in Los Angeles, CA. This year we will be showcasing the latest in high performance Lightwave submount design with fine patterning and 3D shapes. Please visit us in booth 1940!
    http://www.ofcconference.org/en-us/home/