Thin Film Substrates

Design Guidelines

Design Guidelines

Facilities

Tecdia has access to two thin film substrate fabs; one in Japan for prototyping/R&D projects plus one in the Philippines for cost-sensitive projects intended for mass production. Below are generic specifications relating to thin film substrates but for detailed information about each facility, please contact us or see our design guide(s).

Design Guide

Japan Facility: This facility boasts a 1-2 week rapid prototyping for simple designs to help get evaluation of you designs moving!
Philippines Facility: This is a low cost mass production ready facility supporting scalable designs with tan resistors and metalization wrap.

Contact us for help and we can assist find the best facility to support your project based on your requirements.

Layout

ps_hct_contents_12

Materials and Metalization

Common Materials
Units Alumina (Al₂O₃) Aluminum Nitride (AlN)
Thickness mm (mils) 0.254 (10)
0.381 (15)
0.635 (25)
Min: 0.100 (4)
0.254 (10)
0.500 (20)
0.635 (25)
Min: 0.100 (4)
Thickness Tolerance
(Polished)
mm (mils) 0.010 (0.39) 0.010 (0.39)
Size mm (inches) Max: 101.6 X 101.6 (4 X 4)
Min: 0.25 X 0.25 (0.01 X 0.01)
Max: 101.6 X 101.6 (4 X 4)
Min: 0.25 X 0.25 (0.01 X 0.01)
Surface Roughness Top Ra μm (μ”) Polished: 0.025 (1.0) Polished: 0.051 (2.0)
Bottom Ra μm (μ”) Polished: 0.025 (1.0) Polished: 0.051 (2.0)
Dielectric Constant @ 1 MHz 9.9 9.0
Purity N/A 99.6% 99.9%
Color N/A White Grey
Coefficient of Thermal Expansion 1X10⁻⁶/°C 7.0 4.5
Flexural Strength MPa 620 320
Loss Tangent @ 1 MHz 0.0001 0.0003

 

Other Materials

 

Units K=16,000 (@1KHz) K=1,600 (@1KHz)
Thickness mm (mils) 0.150 (6), 0.254 (10) 0.076 (3) ~ 0.254 (10)
Size mm (inches) Max: 4.32 X 4.32 (1.7 X 1.7)
Min: 0.254 X 0.254 (0.01 X 0.01)
Max: 4.32 X 4.32 (1.7 X 1.7)
Min: 0.254 X 0.254 (0.01 X 0.01)
Surface Roughness Top Side As fired Polished
Bottom Side As fired Polished
Dielectric Constant
(Nominal value)
16,000 (@1KHz) 1,600 (@1KHz)
Color Gray Brown
Loss Tangent <6% (@1KHz) <2.5% (@1KHz)

Please contact us for information about our other dielectric materials

 

Metalization
Units Values
Thickness Range μm (μ”) Au: 0.10 – 5.000 (3.93 – 196.85)
Pt: 0.10 – 0.300 (3.93 – 11.81)
Ti: 0.03 – 0.100 (1.18 – 3.93)
Metalization Schemes N/A Ti-Pt-Au
TaN-Ti-Pt-Au
TaN Sheet Resistivity Ω/sq 25
50
75
100
Back to top