Design Guidelines
Facilities
Tecdia has access to three thin film substrate fabs; one in Japan for prototyping/R&D projects, one in the Philippines for cost-sensitive projects intended for mass production and one in the USA for enhanced features and fast lead times. Tecdia is now ITAR compliant and all itar projects are done in our USA facility. Below are generic specifications relating to thin film substrates but for detailed information about each facility, please contact us or see our design guide(s).
USA Facility Design Guide
Philippines Facility Design Guide
USA Facility: Supports planar substrates with features such as laser machined cutouts, through-hole vias, castellated vias, predeposited AuSn, etc. This facility is also ITAR compliant.
Philippines Facility: This is a low cost mass production ready facility supporting scalable designs with tan resistors and metalization wrap.
Contact us for help and we can assist find the best facility to support your project based on your requirements.
Layout
Materials and Metalization
Common Materials
| Units | Alumina (Al₂O₃) | Aluminum Nitride (AlN) | ||
|---|---|---|---|---|
| Thickness | mm (mils) | 0.254 (10) 0.381 (15) 0.635 (25) Min: 0.100 (4) |
0.254 (10) 0.500 (20) 0.635 (25) Min: 0.100 (4) |
|
| Thickness Tolerance (Polished) |
mm (mils) | 0.010 (0.39) | 0.010 (0.39) | |
| Size | mm (inches) | Max: 101.6 X 101.6 (4 X 4) Min: 0.25 X 0.25 (0.01 X 0.01) |
Max: 101.6 X 101.6 (4 X 4) Min: 0.25 X 0.25 (0.01 X 0.01) |
|
| Surface Roughness | Top | Ra μm (μ”) | Polished: 0.025 (1.0) | Polished: 0.051 (2.0) |
| Bottom | Ra μm (μ”) | Polished: 0.025 (1.0) | Polished: 0.051 (2.0) | |
| Dielectric Constant | @ 1 MHz | 9.9 | 9.0 | |
| Purity | N/A | 99.6% | 99.9% | |
| Color | N/A | White | Grey | |
| Coefficient of Thermal Expansion | 1X10⁻⁶/°C | 7.0 | 4.5 | |
| Flexural Strength | MPa | 620 | 320 | |
| Loss Tangent | @ 1 MHz | 0.0001 | 0.0003 | |
Other Materials
| Units | K=16,000 (@1KHz) | K=1,600 (@1KHz) | ||
|---|---|---|---|---|
| Thickness | mm (mils) | 0.150 (6), 0.254 (10) | 0.076 (3) ~ 0.254 (10) | |
| Size | mm (inches) | Max: 4.32 X 4.32 (1.7 X 1.7) Min: 0.254 X 0.254 (0.01 X 0.01) |
Max: 4.32 X 4.32 (1.7 X 1.7) Min: 0.254 X 0.254 (0.01 X 0.01) |
|
| Surface Roughness | Top Side | – | As fired | Polished |
| Bottom Side | – | As fired | Polished | |
| Dielectric Constant (Nominal value) |
– | 16,000 (@1KHz) | 1,600 (@1KHz) | |
| Color | – | Gray | Brown | |
| Loss Tangent | – | <6% (@1KHz) | <2.5% (@1KHz) | |
Please contact us for information about our other dielectric materials
Metalization
| Units | Values | ||
|---|---|---|---|
| Thickness Range | μm (μ”) | Au: 0.10 – 5.000 (3.93 – 196.85) Pt: 0.10 – 0.300 (3.93 – 11.81) Ti: 0.03 – 0.100 (1.18 – 3.93) |
|
| Metalization Schemes | N/A | Ti-Pt-Au TaN-Ti-Pt-Au |
|
| TaN Sheet Resistivity | Ω/sq | 25 50 75 100 |
|
