Hybrid Ceramic Technology

Capabilities

Capabilities

Gold on Alumina Patterning

Our specialized thin film process allows for extreme fine lines on Au, Pt, or TaN. With tight tolerances we can pattern corners, pads and curves to precisely fit your design.

Characteristics

  • Lines and spaces as small as 5 microns
  • Precise tolerances
  • Ti-Pt-Au metalization layers
  • Wraps and side metalization
  • Metalization on slopes and wraps
  • Maskless lithography process

Advantages

  • Design flexibility
  • Strong adhesion
  • Ideal for wire bonding

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TaN Resistor Layers

Our lithography techniques allow for extremely precise resistor placement and size control. A variety of resistor layouts are available.

Characteristics

  • Highly precise placement
  • Highly precise size
  • Flexible design rules

Advantages

  • Excess TaN removal increases performance
  • Integrated circuits

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Sloped Ceramic Submounts

Submounts are no longer limited to squares and rectangles. With pyramidal shapes, slopes, steps, and bevels your design can be made in a variety of ways to optimize the output of your device.

Characteristics

  • Precise angles from 0° to 180°
  • Precise size tolerances

Advantages

  • Increased design flexibility
  • Improved PD alignment accuracy

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