Capabilities
Gold on Alumina Patterning
Characteristics
- Lines and spaces as small as 5 microns
- Precise tolerances
- Ti-Pt-Au metalization layers
- Wraps and side metalization
- Metalization on slopes and wraps
- Maskless lithography process
Advantages
- Design flexibility
- Strong adhesion
- Ideal for wire bonding
TaN Resistor Layers
Characteristics
- Highly precise placement
- Highly precise size
- Flexible design rules
Advantages
- Excess TaN removal increases performance
- Integrated circuits
Sloped Ceramic Submounts
Characteristics
- Precise angles from 0° to 180°
- Precise size tolerances
Advantages
- Increased design flexibility
- Improved PD alignment accuracy