Thin Film Technology
Our thin film substrates divisions combine over 35 years of experience in ceramics, machining, wafer processing, and micro-circuits into one group that specializes in advanced ceramic substrate technologies. Tecdia’s engineers push the limits of ceramic technology while maintaining the standard of quality that Tecdia has always been known for. Processes such as bridges, laser drilled through holes, and dry etched fine patterns are all specialized for low-loss, small package communication devices. Our substrates are for engineers that wish to improve the speed, coherence, and form factor of their devices. Tecdia underpins the future of ceramic process technology.