Storage and Application Notes

Storage and Application Notes

Storage Notes

The following storage conditions are recommended for our products:

Product Warranty One year after delivery*2
Storage Condition*1 In Waffle Pack Dry environment temp.: -55°C to +40°C
Humidity less than 70%RH
In Tape Container (except UV tape) Dry environment temp.: +20°C to +26°C
Humidity less than 60%RH

*1 Avoid storing in environments where parts will be exposed to direct sunlight, vibration, impact, corrosive gases, other special gases, freezing condensation, or dust. Never touch parts with bare hands.

*2 Although the product warranty may still be valid, Blue Tape and UV tape packaging has a guaranteed shelf life of 3 months after delivery.

Recommended Installation Conditions and Precautions

Die Attach Conditions

Compatibility with different solders and epoxies vary between products. See the information on product types for more details. Take care to avoid shorts caused by an excess of bonding material at installation. Installation processes can also lead to cracking, so we recommend that users carefully verify conditions.

Recommended Conditions for Wire Bonding

Wire to be used

Au wire: less than 30 um dia.

Bonding  temperature

Wedge bonding: 200 ~ 270°C

Ball bonding: 150 ~ 250°C

We recommend this in conjunction with tool heating.

Bonding methods

Thermocompression bonding and ultrasonic thermocompression bonding.


Bond in a location at least 25 um from the edge of the bonding pad.

Also, as bonding acceleration with hard wire, there could damage the front of the ceramic material, or could cause peeling, so we recommend that you understand the installation conditions and make proper adjustments. Option: Using harder wire for high speed bonding increases the risk of damaging metallization adhesion as well as chip cracking due to greater bonding force, so proper adjustments should be made. Bordered capacitors manufactured with GBBL materials may exhibit edge micro fracturing which cannot be observed during visual inspection. Consequently, small ceramic grains could dislodge from the ceramic body as a result of die attachment, wedge bonding or other assembly and environmental conditions.

Back to top