Single Layer Chip Capacitors

Single Layer Chip Capacitors

Overview

Tecdia Chip Capacitors are normally constructed as square chips for single values and binary capacitor arrays, and in rectangular shapes for capacitor row arrays and custom designs. Tecdia uses variations in chip thickness (by lapping), as well as electrode/ceramic size and dielectric constant to construct capacitors. This permits a broad range of capacitance values to be manufactured with various form factors and designs.

Border Styles

Type A capacitors have a border around the top electrode which helps to prevent epoxy creep-up related shorts and may aid in optical recognition with automated equipment. The bottom electrode is suitable for both epoxy and solder die attach.

Type B capacitors have a border around the top and bottom electrodes which helps to prevent epoxy creep-up related shorts and may aid in optical recognition with automated equipment. The bottom electrode is not suitable for solder die attach as the solder barrier layer has been removed. These capacitors can be used upside-down so top/bottom orientation is not important.

Type C capacitors do not have borders and are a lower cost option. These capacitors can be used upside-down so top/bottom orientation is not important.

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