・Number of scribing points: 2
・Ridge line angle: 35°
・Recommended scribing angle: 56 to 65°
・Characteristics: A sharp and narrow cut point allows for scribing deep trench, bump or mesa structures without touching the trench edges. The cutting point is similar to 4 point toe tools but much thinner for clearance.
・Case study: Singulating Grooved Wafers
3 Point Tool (Toe) P/N: TD-3YP
・Number of cut points: 3
・Ridge line angle: 22.5°
・Recommended scribing angle: 68° to 72°
・Characteristics: The curved ridges surrounding the cutting point allow for maximum downward force yielding a wide and deep scribe line. This tool type is commonly used for hard and thick wafer materials.
・Case Study: Singulating Hard Wafer Material: SiC
4 Point Tool (Toe) P/N: TD-4PSS
・ Number of cut points: 4
・ Ridge line angle: 35°
・ Recommended scribing angle: 56°to 65°
・ Characteristics: With the cutting point at the tip, toe point tools yield a sharp and narrow scribe line which is ideal for softer wafer materials that only require minimal scribing pressure.
4 Point Tool (Heel) P/N: TD-410, TD-420
・ Number of cut points: 4
・ Ridge line angle: 35°
・ Recommended scribing angle: 52° to 55°
・ Characteristics: Unlike the toe point, the triangular heel point has a wide cut line making it ideal for thicker and softer materials which also helps to reduce chipping.
・ Case study: Singulating Soft Wafer Material: Zinc Oxide (ZnO)
