Skip to Content
TECDIA. Let's do this.
  • Language
    • 日本語
    • English
    • 한국어
    • 中文(简体)
    • 中文(繁體)
search opener
  • Catalogs
    • Ceramic Products Catalog
    • Dispensing Nozzles Catalog
    • Diamond Scribe Tools Catalog
    • Substrate Design Guide
    • Company Profile Leaflet
    • Precision Machining Technologies
  • Case Studies
    • Increased demand for InP semiconductors due to the development of 5G
    • Single-layer Ceramic Capacitors that Contribute to the Development of 5G
    • Why Tecdia Dispenser Nozzles are Selected for Liquid Crystal Device Manufacturing
    • Ruby Nozzle created for liquid crystal panel manufacturing to improve coating quality
    • Ultra-High K Single Layer Chip Capacitors
    • Diamond Tipped Ejector Needles for Semiconductor Manufacturing
    • 3D Printing Gears with Tecdia’s Dispensing Nozzles
    • Cost Reductions Through Changing Dispensing Nozzles
    • Growing Focus on Revolutionary GaN Technology
    • 3D Printed Breast Implants for Breast Cancer Patients
    • Ceramic Capacitor with Predeposited Solder
    • One-Stop Manufacturing/Assembly Services
    • Medical Microneedles
    • Diamond Pickup Tool for Liquid Crystal Devices
    • Super-Long Tipped Nozzles
    • Ground Block using Conductive Ceramic
    • ARQUÉ Dispensing Nozzles used in 3D Bioprinting Research
    • NASA Chooses Tecdia for Precision TaN Circuits
    • Scribing New-Generation Wafers
    • Space Saving with RC Circuit
    • Nozzles for Highly Controlled Dispensing
    • Singulating Soft Wafer Material: Zinc Oxide (ZnO)
    • Singulating Grooved Wafers
    • Singulating Hard Wafer Material: SiC
    • Diamond Brazing Technology: Diamond Nanoindenter
    • Perfect Wafer Scribing with Tool Setting
  • Products & Services
    • New!
      • Ultra-Small Tight-Tolerance Resistors
      • Solder-Ready SLCs
      • Ground Blocks
    • Thin-Film Substrates
      • Overview
      • Capabilities
      • Design Guidelines
    • Ceramic Products
      • Ceramic Product Search
      • Ceramic Products List
      • Advanced Topics
    • Precision Products
      • Overview
      • Dispensing Nozzles
      • Needles
      • Precision Machined Goods
    • Diamond Products
      • Overview
      • Diamond Scribe Tools
      • Handy Wafer Scriber
      • Diamond Needles
      • Diamond Indenters
      • Diamond Pickup Tools
    • Contract Manufacturing Services
      • Overview
      • Global Advantage
      • Available Equipment
      • Operations and Policies
  • About Us
    • About Tecdia
    • Our Promise
    • Global Network
    • Join Us
      • Overview & Positions
  • Contact
    • Contact Info
    • FAQs
      • Ceramic Products
      • Precision Products
      • Diamond Products

Performance Graphs

  • Top
  • Products & Services
  • Performance Graphs

Performance Graphs


Typical Temperature Characteristics

Typical Aging Characteristics

Typical DC Bias Characteristics


Typical Resonance Frequencies


Products & Services

  • Thin-Film Substrates
    • Overview
    • Capabilities
    • Design Guidelines
  • Ceramic Products
    • Ceramic Product Search
    • Ceramic Products List
      • Single Layer Chip Capacitors
        • Type A Capacitors
        • Type B Capacitors
        • Type C Capacitors
      • Rectangular SLCs
      • Binary Capacitors
      • Gap Capacitors
      • Row Capacitors
      • Integrated Resistor-Capacitors
      • Ground Blocks
      • Thin Film Chip Resistors
  • Advanced Topics
    • Inspection Standards
    • Dielectric Specifications
    • Performance Graphs
    • Packaging/Compliance
    • Storage and Application Notes
  • Precision Products
    • Overview
    • Dispensing Nozzles
      • ARQUE
      • Super-Long Tipped Nozzles
      • Ruby Nozzles
      • Special Application Nozzles
    • Needles
      • Ejector Needles
      • Probe Needles
      • Diamond Needles
    • Precision Machined Goods
      • Multi-Nozzles Dispensing Fixtures
      • Needle Holders
      • Vacuum Stages (Pepper Pot)
      • Polished Pipe Interior
      • Custom Tools and Jigs
  • Diamond Products
    • Overview
    • Diamond Scribe Tools
    • Handy Wafer Scriber
    • Diamond Needles
    • Diamond Indenters
    • Diamond Pickup Tools
  • Contract Manufacturing Services
    • Overview
    • Global Advantage
    • Available Equipment
    • Operations and Policies
Back to top

New!

  • Tight-Tolerance Resistors
  • Solder-Ready SLCs
  • Rectangular SLCs

Products

  • Thin-Film Substrates
  • Ceramics Products
  • Precision Products
  • Diamond Products
  • Contract Manufacturing Services

Case Studies

  • Increased demand for InP semiconductors due to the development of 5G
  • Single-layer Ceramic Capacitors that Contribute to the Development of 5G
  • Why Tecdia Dispenser Nozzles are Selected for Liquid Crystal Device Manufacturing
  • Ruby Nozzle created for liquid crystal panel manufacturing to improve coating quality
  • Ultra-High K Single Layer Chip Capacitors
  • Diamond Tipped Ejector Needles for Semiconductor Manufacturing
  • 3D Printing Gears with Tecdia’s Dispensing Nozzles
  • Cost Reductions Through Changing Dispensing Nozzles
  • Growing Focus on Revolutionary GaN Technology
  • 3D Printed Breast Implants for Breast Cancer Patients
  • One-Stop Manufacturing/Assembly Services
  • Medical Microneedles
  • Diamond Pickup Tool for Liquid Crystal Devices
  • Super-Long Tipped Nozzles
  • Ground Block using Conductive Ceramic
  • ARQUÉ Dispensing Nozzles used in 3D Bioprinting Research
  • NASA Chooses Tecdia for Precision TaN Circuits
  • Scribing New-Generation Wafers
  • Space Saving with RC Circuit
  • Nozzles for Highly Controlled Dispensing
  • Singulating Soft Wafer Material: Zinc Oxide (ZnO)
  • Singulating Grooved Wafers
  • Singulating Hard Wafer Material: SiC
  • Diamond Brazing Technology: Diamond Nanoindenter
  • Perfect Wafer Scribing with Tool Setting

Join Us

  • Overview & Positions

About Us

  • About Tecdia
  • Our Promise
  • Global Network

Contact Us

  • Contact Info

FAQ

  • Ceramic Products
  • Precision Machined Products
  • Diamond Industrial Products

Contact Us







  • List of All Case Studies
  • List of All Products & Services
  • List of All Catalog Downloads
  • Site Map
  • Privacy Policy
Back to top
TECDIA. Let's do this.
Tecdia Inc.

2255 S. Bascom Ave., Ste. 120, Campbell, CA 95008, U.S.A.

+1-408-748-0100

FindUsOnFacebookCopyright © Tecdia Co.,Ltd.

2 Point Tool (Toe)
P/N: TD-2P

td-2p

・Number of scribing points: 2
・Ridge line angle: 35°
・Recommended scribing angle: 56 to 65°
・Characteristics: A sharp and narrow cut point allows for scribing deep trench, bump or mesa structures without touching the trench edges. The cutting point is similar to 4 point toe tools but much thinner for clearance.
・Case study: Singulating Grooved Wafers

3 Point Tool (Toe)
P/N: TD-3YP

td-2p

・Number of cut points: 3
・Ridge line angle: 22.5°
・Recommended scribing angle: 68° to 72°
・Characteristics: The curved ridges surrounding the cutting point allow for maximum downward force yielding a wide and deep scribe line. This tool type is commonly used for hard and thick wafer materials.
・Case Study: Singulating Hard Wafer Material: SiC

4 Point Tool (Toe)
P/N: TD-4PSS

td-2p

・ Number of cut points: 4
・ Ridge line angle: 35°
・ Recommended scribing angle: 56°to 65°
・ Characteristics: With the cutting point at the tip, toe point tools yield a sharp and narrow scribe line which is ideal for softer wafer materials that only require minimal scribing pressure.

4 Point Tool (Heel)
P/N: TD-410, TD-420

td-2p

・ Number of cut points: 4
・ Ridge line angle: 35°
・ Recommended scribing angle: 52° to 55°
・ Characteristics: Unlike the toe point, the triangular heel point has a wide cut line making it ideal for thicker and softer materials which also helps to reduce chipping.
・ Case study: Singulating Soft Wafer Material: Zinc Oxide (ZnO)