Inspection Standards
Tecdia adopts various inspection standards depending on the type of product and application or industry. Loosely put, inspection grades can be classified into three types: standard, commercial, and custom.
All of our products go through mechanical and electrical characteristic inspection sampling and 100% visual inspection as a minimum.
We can also support MIL-PRF-49464 Class A/B screening and MIL-PRF-38534 Class H and Class K screening upon request.
Standard Inspection (By Product Type)
- Type A Capacitors (Class I/II/IV)
- Type B Capacitors (Class I/II/IV)
- Type C Capacitors (Class I/II/IV)
- Rectangular Capacitors (Class I/II)
- Binary Capacitors (Class I/II)
- Gap Capacitors (Class I/II)
| Dielectric Class | Class I/II | Class IV | ||
|---|---|---|---|---|
| Inspection Item | Inspection Quantity | Allowable Failures | ||
| Visual Inspection | Standard Grade | Inspection Lot AQL II (1.0％) | Inspection Lot AQL II (1.0％) | – |
| Commercial Grade | Inspection Lot AQL II (1.0％) | Inspection Lot AQL II (1.0％) | – | |
| Electrical Characteristics | Capacitance | Inspection Lot AQL II (1.0％) | Inspection Lot AQL II (1.0％) | – |
| Dissipation Factor | Inspection Lot AQL II (1.0％) | Inspection Lot AQL II (1.0％) | – | |
| Insulation Resistance | 10 pcs per Wafer Lot | Inspection Lot AQL I (0.15％) | 0/10 | |
| Withstanding Voltage | 10 pcs per Wafer Lot | 10 pcs per Wafer Lot | 0/10 | |
| Mechanical Characteristics | Wire Pull | 3 pcs per Wafer Lot | 3 pcs per Wafer Lot | 0/3 |
| Die Shear | 3 pcs per Wafer Lot | 3 pcs per Wafer Lot | 0/3 | |
| Heat Resistance | 400°C For 5 min. | 5 pcs per Wafer Lot | X | 0/5 |
| Dimensions | Dimension Measurement | 3 pcs per Wafer Lot | 3 pcs per Wafer Lot | 0/3 |
| Inspection Item | Inspection Quantity | Allowable Failures | |
|---|---|---|---|
| Visual Inspection | Inspection Lot AQL II (1.0％) | – | |
| Electrical Characteristics | Resistance | Inspection Lot AQL I(1.5%) | – |
| Mechanical Characteristics | Wire Pull | 3 pcs per Wafer Lot | 0/3 |
| Die Shear | 3 pcs per Wafer Lot | 0/3 | |
| Heat Resistance | 320°C For 5 min. | 3 pcs per Wafer Lot | 0/3 |
| Dimensions | Dimension Measurement | 3 pcs per Wafer Lot | 0/3 |
| Inspection Item | Inspection Quantity | Allowable Failures | |
|---|---|---|---|
| Visual Inspection | Inspection Lot AQL II (1.0％) | – | |
| Mechanical Characteristics | Wire Pull | 3 pcs per Wafer Lot | 0/3 |
| Die Shear | 3 pcs per Wafer Lot | 0/3 | |
| Heat Resistance | 400°C For 5 min. | 3 pcs per Wafer Lot | 0/3 |
| Dimensions | Dimension Measurement | 3 pcs per Wafer Lot | 0/3 |
| Inspection Item | Inspection Quantity | Allowable Failures | |
|---|---|---|---|
| Visual Inspection | Inspection Lot AQL II (1.0％) | – | |
| Dimensions | Dimension Measurement | 3 pcs per Wafer Lot | 0/3 |
*The items measured for thin film substrate products depend on the particular design. Contact us for details.
Custom Inspection/Testing For Capacitors
| Inspection Standard | Inspection Class |
|---|---|
| MIL-PRF-38534 | H & K |
| MIL-PRF-49464 | A & B |
| Custom | As Requested |
Test Capabilities
| Item | Test Condition | ||||||
|---|---|---|---|---|---|---|---|
| Temperature Cycling | MIL-STD-883 / Method 1010 Cond. A / B / C | ||||||
| Thermal Shock | MIL-STD-202 / Method 107 Cond. A / B / F | ||||||
| Burn-In | MIL-STD-883 / Method 1015 Cond. A / B / C / F | ||||||
| Capacitance | MIL-STD-202 / Method 305 | ||||||
| Insulation Resistance | MIL-STD-202 / Method 302 | ||||||
| Withstanding Voltage | MIL-STD-202 / Method 301 | ||||||
| Wire Pull | MIL-STD-883 / Method 2011 Cond. D | ||||||
| Die Shear | MIL-STD-883 / Method 2019 最大 3 kg | ||||||
| Temperature Characteristic | EIA-198 / Method 105 | ||||||
| Immersion | MIL-STD-202 / Method 104 | ||||||
| Resistance to Soldering Heat | MIL-STD-202 / Method 210 Cond. A / B / C / D | ||||||
| Moisture Resistance | MIL-STD-202 / Method 106 | ||||||
| Life | MIL-STD-202 / Method 108 Max 150°C | ||||||
| Humidity (Steady State) | MIL-STD-202 / Method 103 | ||||||
| Constant Acceleration | MIL-STD-883 / Method 2001 Cond. A / B / C / D / E / F / G / H / Y1 | ||||||
| Vibration | MIL-STD-202 / Method 201 | ||||||
| High Frequency Vibration | MIL-STD-202 / Method 204 Cond. A / B / C / D | ||||||
| Variable Frequency Vibration | MIL-STD-883 / Method 2007 Cond. A | ||||||
