Inspection Standards

Inspection Standards

Tecdia adopts various inspection standards depending on the type of product and application or industry. Loosely put, inspection grades can be classified into three types: standard, commercial, and custom.

All of our products go through mechanical and electrical characteristic inspection sampling and 100% visual inspection as a minimum.

We can also support MIL-PRF-49464 Class A/B screening and MIL-PRF-38534 Class H and Class K screening upon request.

Standard Inspection (By Product Type)

Dielectric Class Class I/II Class IV
Inspection Item Inspection Quantity Allowable Failures
Visual Inspection Standard Grade Inspection Lot AQL II (1.0%) Inspection Lot AQL II (1.0%)
Commercial Grade Inspection Lot AQL II (1.0%) Inspection Lot AQL II (1.0%)
Electrical Characteristics Capacitance Inspection Lot AQL II (1.0%) Inspection Lot AQL II (1.0%)
Dissipation Factor Inspection Lot AQL II (1.0%) Inspection Lot AQL II (1.0%)
Insulation Resistance 10 pcs per Wafer Lot Inspection Lot AQL I (0.15%) 0/10
Withstanding Voltage 10 pcs per Wafer Lot 10 pcs per Wafer Lot 0/10
Mechanical Characteristics Wire Pull 3 pcs per Wafer Lot 3 pcs per Wafer Lot 0/3
Die Shear 3 pcs per Wafer Lot 3 pcs per Wafer Lot 0/3
Heat Resistance 400°C For 5 min. 5 pcs per Wafer Lot X 0/5
Dimensions Dimension Measurement 3 pcs per Wafer Lot 3 pcs per Wafer Lot 0/3

Integrated Resistor-Capacitors

Inspection Item Inspection Quantity Allowable Failures
Visual Inspection Inspection Lot AQL II (1.0%)
Electrical Characteristics Capacitance Inspection Lot AQL II (1.0%)
Dissipation Factor Inspection Lot AQL II (1.0%)
Insulation Resistance Inspection Lot AQL I (0.15%)
Withstanding Voltage 10 pcs per Wafer Lot 0/10
Resistance Inspection Lot AQL I(1.5%)
Mechanical Characteristics Wire Pull 3 pcs per Wafer Lot 0/3
Die Shear 3 pcs per Wafer Lot 0/3
Dimensions Dimension Measurement 3 pcs per Wafer Lot 0/3

Thin Film Chip Resistors

Inspection Item Inspection Quantity Allowable Failures
Visual Inspection Inspection Lot AQL II (1.0%)
Electrical Characteristics Resistance Inspection Lot AQL I(1.5%)
Mechanical Characteristics Wire Pull 3 pcs per Wafer Lot 0/3
Die Shear 3 pcs per Wafer Lot 0/3
Heat Resistance 320°C For 5 min. 3 pcs per Wafer Lot 0/3
Dimensions Dimension Measurement 3 pcs per Wafer Lot 0/3

Ground Blocks

Inspection Item Inspection Quantity Allowable Failures
Visual Inspection Inspection Lot AQL II (1.0%)
Mechanical Characteristics Wire Pull 3 pcs per Wafer Lot 0/3
Die Shear 3 pcs per Wafer Lot 0/3
Heat Resistance 400°C For 5 min. 3 pcs per Wafer Lot 0/3
Dimensions Dimension Measurement 3 pcs per Wafer Lot 0/3

Thin Film Substrates

Inspection Item Inspection Quantity Allowable Failures
Visual Inspection Inspection Lot AQL II (1.0%)
Dimensions Dimension Measurement 3 pcs per Wafer Lot 0/3

*The items measured for thin film substrate products depend on the particular design. Contact us for details.

Custom Inspection/Testing For Capacitors

 

Inspection Standard Inspection Class
MIL-PRF-38534 H & K
MIL-PRF-49464 A & B
Custom As Requested

Test Capabilities

 

Item Test Condition
Temperature Cycling MIL-STD-883 / Method 1010 Cond. A / B / C
Thermal Shock MIL-STD-202 / Method 107 Cond. A / B / F
Burn-In MIL-STD-883 / Method 1015 Cond. A / B / C / F
Capacitance MIL-STD-202 / Method 305
Insulation Resistance MIL-STD-202 / Method 302
Withstanding Voltage MIL-STD-202 / Method 301
Wire Pull MIL-STD-883 / Method 2011 Cond. D
Die Shear MIL-STD-883 / Method 2019 最大 3 kg
Temperature Characteristic EIA-198 / Method 105
Immersion MIL-STD-202 / Method 104
Resistance to Soldering Heat MIL-STD-202 / Method 210 Cond. A / B / C / D
Moisture Resistance MIL-STD-202 / Method 106
Life MIL-STD-202 / Method 108 Max 150°C
Humidity (Steady State) MIL-STD-202 / Method 103
Constant Acceleration MIL-STD-883 / Method 2001 Cond. A / B / C / D / E / F / G / H / Y1
Vibration MIL-STD-202 / Method 201
High Frequency Vibration MIL-STD-202 / Method 204 Cond. A / B / C / D
Variable Frequency Vibration MIL-STD-883 / Method 2007 Cond. A
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