Gap capacitors eliminate the need for wire-bonds by enabling SMD type die attach processes.
- 2-ports (electrodes) on the same surface for top side bonding
- Can be flip-chipped upside-down to eliminate wire bonding
- Planar electrodes form series capacitor
*Typical resonant frequency data from application notes does not apply to this product series.
Key to Part Numbers
Our gap capacitors follow a different part numbering scheme from standard square type. Each part of the PN is structured as follows.
Depending on the ceramic dielectric used and electrode configuration, we use different metal stacks to achieve best mechanical and electrical performances. The different stacks we may use are as follows.
|Top||TiW – Au OR TaN – TiW – Au|
|Bottom||TiW – Pt – Au OR TaN – TiW – Pt – Au OR TiW – Au OR TaN – TiW – Au|
Tecdia has a range of standard binary capacitors. Below are a list of some of the off the shelf parts we have available.
|Part Number||Capacitance Code of Each Pad||Capacitance Mounted (pF)||Size (mils)||Side (mm)||Dielectric|
|AMG0R5B1AG||0R5||0.25||12 × 24||0.3 × 0.6||K = 140|
|BMG0R5B1AG||0R5||0.25||12 × 24||0.3 × 0.6||K = 140|
|AMG5R0K2AG||5R0||2.5||12 × 24||0.3 × 0.6||K = 1,600|
|BMG5R0K2AG||5R0||2.5||12 × 24||0.3 × 0.6||K = 1,600|
|AMG150K2BG||150||7.5||20 × 33||0.5 × 0.85||K = 1,600|
|BMG150K2BG||150||7.5||20 × 33||0.5 × 0.85||K = 1,600|
|AMG250K2BG||250||12.5||20 × 33||0.5 × 0.85||K = 2,800|
|BMG250K2BG||250||12.5||20 × 33||0.5 × 0.85||K = 2,800|
Note: If you have custom specifications you wish to satisfy then Tecdia can tailor the dimensions, dielectric constant, capacitance, TC and other options to match target capacitance options desired. For immediate assistance just give us a call at 408-748-0100 (USA) or contact us electronically using our contact form, tell us your requirements and we will find you the perfect part for you.