Dielectric Specifications

The dielectric materials used for our ceramic capacitors can be categorized in Class I to IV materials based on their temperature characteristic as per EIA standards. We have the ability to manipulate capacitor size, thickness and dielectric constant, to come up with a perfect balance of specifications to yield ultimate performance in your application.

Our chip resistor products use either Alumina or Aluminum Nitride as the based material. Our thin film substrate line also patterns on these materials, as well as several others.

Dielectric Material Characteristics

EIA Class*2	Tecdia Dielectric Code	Relative Permeabilty (Nominal Value)	Dissipation Factor @25°C	Insulation Resistance @25°C	EIA TC Code*2	Temperature Characteristic	Temperature Range
1	P	40	< 0.15% @ 1 MHz	106MΩ	C0G	0 ± 30 ppm/°C	-55°C to +125°C
1	4	90	< 0.25% @ 1 MHz	106MΩ	S2H	-330 ± 60 ppm/°C	-55°C to +125°C
1	5	140	< 0.25% @ 1 MHz	106MΩ	U2J	-750 ± 120 ppm/°C	-55°C to +125°C
1	7	280	< 0.25% @ 1 MHz	105MΩ*1	M3K	-1000 ± 250 ppm/°C	-55°C to +125°C
2	F	1,600	< 2.5% @ 1 kHz	105MΩ	X7R	± 15%	-55°C to +125°C
2	C	2,800	< 2.5% @ 1 kHz	105MΩ	X7R	± 15%	-55°C to +125°C
4	10	16,000	< 2.5% @ 1 kHz	104MΩ	X7S	± 22%	-55°C to +125°C
4	11	30,000	< 2.5% @ 1 kHz	104MΩ	X7S	± 22%	-55°C to +125°C
4	12	50,000	< 2.5% @ 1 kHz	104MΩ	X7S	± 22%	-55°C to +125°C

^*1 Special order products can be made to 10⁶MΩ @25°C.
^*2 Refer to EIA-198-1-F.

Thin Film Substrate Characteristics

Property	Units	Alumina	Aluminum Nitride	Fused Silica
Color	–	White	Gray	Transparent
Purity	%	99.6*	–	–
Density	g/㎝2	3.88	3.3	2.2
Thermal Conductivity	W/m･K	26.9	170	1.38
Thermal Expansion	X10-6/°C	25~300°C: 7	4	0.57
		25~600°C: 7.2
Relative Permeability ε	@1MHz	9.9	8.8	3.79
Dielectric Loss	@1MHz	0.0001	0.0001	0.00002
Bulk Resistivity	Ω・cm	25°C: >1.0×1014	1.0×1014	TBC
		100°C: >1.0×1014
		300°C: >1.0×1014

*Alumina 96％ and 99.5% also available.