Dielectric Specifications

Dielectric Specifications

The dielectric materials used for our ceramic capacitors can be categorized in Class I to IV materials based on their temperature characteristic as per EIA standards. We have the ability to manipulate capacitor size, thickness and dielectric constant, to come up with a perfect balance of specifications to yield ultimate performance in your application.

Our chip resistor products use either Alumina or Aluminum Nitride as the based material. Our thin film substrate line also patterns on these materials, as well as several others.

Dielectric Material Characteristics

EIA Class*2 Tecdia Dielectric Code Relative Permeabilty
(Nominal Value)
Dissipation Factor @25°C Insulation Resistance @25°C EIA TC Code*2 Temperature Characteristic Temperature Range
1 P 40 < 0.15% @ 1 MHz 106 C0G 0 ± 30 ppm/°C -55°C to +125°C
1 4 90 < 0.25% @ 1 MHz 106 S2H -330 ± 60 ppm/°C -55°C to +125°C
1 5 140 < 0.25% @ 1 MHz 106 U2J -750 ± 120 ppm/°C -55°C to +125°C
1 7 280 < 0.25% @ 1 MHz 105MΩ*1 M3K -1000 ± 250 ppm/°C -55°C to +125°C
2 F 1,600 < 2.5% @ 1 kHz 105 X7R ± 15% -55°C to +125°C
2 C 2,800 < 2.5% @ 1 kHz 105 X7R ± 15% -55°C to +125°C
4 10 16,000 < 2.5% @ 1 kHz 104 X7S ± 22% -55°C to +125°C
4 11 30,000 < 2.5% @ 1 kHz 104 X7S ± 22% -55°C to +125°C
4 12 50,000 < 2.5% @ 1 kHz 104 X7S ± 22% -55°C to +125°C

*1 Special order products can be made to 106MΩ @25°C.
*2 Refer to EIA-198-1-F.

Thin Film Substrate Characteristics

Property Units Alumina Aluminum Nitride Fused Silica
Color White Gray Transparent
Purity % 99.6*
Density g/㎝2 3.88 3.3 2.2
Thermal Conductivity W/m・K 26.9 170 1.38
Thermal Expansion X10-6/°C 25~300°C: 7 4 0.57
25~600°C: 7.2
Relative Permeability ε @1MHz 9.9 8.8 3.79
Dielectric Loss @1MHz 0.0001 0.0001 0.00002
Bulk Resistivity Ω・cm 25°C: >1.0×1014 1.0×1014 TBC
100°C: >1.0×1014
300°C: >1.0×1014

*Alumina 96% and 99.5% also available.

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