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Available Equipment Manual Pin Set Bonder
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New!

  • Solder-Ready SLCs
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Case Studies

  • Cost Reductions Through Changing Dispensing Nozzles
  • Growing Focus on Revolutionary GaN Technology
  • 3D Printed Breast Implants for Breast Cancer Patients
  • One-Stop Manufacturing/Assembly Services
  • Medical Microneedles
  • Diamond Pickup Tool for Liquid Crystal Devices
  • Super-Long Tipped Nozzles
  • Ground Block using Conductive Ceramic
  • ARQUÉ Dispensing Nozzles used in 3D Bioprinting Research
  • NASA Chooses Tecdia for Precision TaN Circuits
  • Scribing New-Generation Wafers
  • Space Saving with RC Circuit
  • Nozzles for Highly Controlled Dispensing
  • Singulating Soft Wafer Material: Zinc Oxide (ZnO)
  • Singulating Grooved Wafers
  • Singulating Hard Wafer Material: SiC
  • Diamond Brazing Technology: Diamond Nanoindenter
  • Perfect Wafer Scribing with Tool Setting

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TECDIA. Let's do this.
Tecdia Inc.

2255 S. Bascom Ave., Ste. 120, Campbell, CA 95008, U.S.A.

+1-408-748-0100

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2 Point Tool (Toe)
P/N: TD-2P

td-2p

・Number of scribing points: 2
・Ridge line angle: 35°
・Recommended scribing angle: 56 to 65°
・Characteristics: A sharp and narrow cut point allows for scribing deep trench, bump or mesa structures without touching the trench edges. The cutting point is similar to 4 point toe tools but much thinner for clearance.
・Case study: Singulating Grooved Wafers

3 Point Tool (Toe)
P/N: TD-3YP

td-2p

・Number of cut points: 3
・Ridge line angle: 22.5°
・Recommended scribing angle: 68° to 72°
・Characteristics: The curved ridges surrounding the cutting point allow for maximum downward force yielding a wide and deep scribe line. This tool type is commonly used for hard and thick wafer materials.
・Case Study: Singulating Hard Wafer Material: SiC

4 Point Tool (Toe)
P/N: TD-4PSS

td-2p

・ Number of cut points: 4
・ Ridge line angle: 35°
・ Recommended scribing angle: 56°to 65°
・ Characteristics: With the cutting point at the tip, toe point tools yield a sharp and narrow scribe line which is ideal for softer wafer materials that only require minimal scribing pressure.

4 Point Tool (Heel)
P/N: TD-410, TD-420

td-2p

・ Number of cut points: 4
・ Ridge line angle: 35°
・ Recommended scribing angle: 52° to 55°
・ Characteristics: Unlike the toe point, the triangular heel point has a wide cut line making it ideal for thicker and softer materials which also helps to reduce chipping.
・ Case study: Singulating Soft Wafer Material: Zinc Oxide (ZnO)