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    • Increased demand for InP semiconductors due to the development of 5G
    • Single-layer Ceramic Capacitors that Contribute to the Development of 5G
    • Why Tecdia Dispenser Nozzles are Selected for Liquid Crystal Device Manufacturing
    • Ruby Nozzle created for liquid crystal panel manufacturing to improve coating quality
    • Ultra-High K Single Layer Chip Capacitors
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    • Cost Reductions Through Changing Dispensing Nozzles
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    • Ground Block using Conductive Ceramic
    • ARQUÉ Dispensing Nozzles used in 3D Bioprinting Research
    • NASA Chooses Tecdia for Precision TaN Circuits
    • Scribing New-Generation Wafers
    • Space Saving with RC Circuit
    • Nozzles for Highly Controlled Dispensing
    • Singulating Soft Wafer Material: Zinc Oxide (ZnO)
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Ceramic Product Search

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  • Ceramic Product Search

Ceramic Product Search

Part numbers and specifications for Tecdia ceramic components can be searched and referenced using the tool on this page.
  • Single Layer Chip Capacitors
  • Single Layer Row Capacitors
  • Thin Film Chip Resistors
  • IRC™ Integrated Resistor-Capacitor
  • Search by Part Number

Single Layer Chip Capacitors

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Dielectric constants 40 to 50,000 available in three configurations for solder or epoxy die attachment.
Ceramic Product Comprehensive Catalog
Catalog Download

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Single Layer Row Capacitors

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Hi-K capacitors available in a 2,3 or 4 pad arrays. Sharing common backside metalization, this configuration provides space and cost savings.
ALTAS® Ultra High-K Row Capacitors (K=16,000) Catalog Download

Thin Film Chip Resistors

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Wirebondable single layer thin film resistors suitable for both AuSn and epoxy die attachment. Available in sizes from 16 x 16 mils with power handling up to 100mW.
Thin Film Chip Resistors Catalog Download

IRC™ Integrated Resistor-Capacitor

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Wirebondable Hi-K capacitor and resistor network suitable for both AuSn and epoxy die attachment. Reduces component count and maximizes layout flexibility.
IRC™ Integrated Resistor-Capacitor Catalog Download

Product ID Search

Results Found. Please select the components that you would like to inquire about.
No results match your search criteria.Please refine your search, contact us here or call us +1 (408) 748-0100.
Part number Specs Cap. (pF) Tol. Size (mil/mm) Size Tol. (mil/mm) Thickness (mil/mm) Thickness Tol. (mil/mm) RWV Type TC

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Products & Services

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  • Advanced Topics
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  • Precision Products
    • Overview
    • Dispensing Nozzles
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  • Diamond Products
    • Overview
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    • Diamond Needles
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  • Contract Manufacturing Services
    • Overview
    • Global Advantage
    • Available Equipment
    • Operations and Policies

New!

  • Tight-Tolerance Resistors
  • Solder-Ready SLCs
  • Rectangular SLCs

Products

  • Thin-Film Substrates
  • Ceramics Products
  • Precision Products
  • Diamond Products
  • Contract Manufacturing Services

Case Studies

  • Increased demand for InP semiconductors due to the development of 5G
  • Single-layer Ceramic Capacitors that Contribute to the Development of 5G
  • Why Tecdia Dispenser Nozzles are Selected for Liquid Crystal Device Manufacturing
  • Ruby Nozzle created for liquid crystal panel manufacturing to improve coating quality
  • Ultra-High K Single Layer Chip Capacitors
  • Diamond Tipped Ejector Needles for Semiconductor Manufacturing
  • 3D Printing Gears with Tecdia’s Dispensing Nozzles
  • Cost Reductions Through Changing Dispensing Nozzles
  • Growing Focus on Revolutionary GaN Technology
  • 3D Printed Breast Implants for Breast Cancer Patients
  • One-Stop Manufacturing/Assembly Services
  • Medical Microneedles
  • Diamond Pickup Tool for Liquid Crystal Devices
  • Super-Long Tipped Nozzles
  • Ground Block using Conductive Ceramic
  • ARQUÉ Dispensing Nozzles used in 3D Bioprinting Research
  • NASA Chooses Tecdia for Precision TaN Circuits
  • Scribing New-Generation Wafers
  • Space Saving with RC Circuit
  • Nozzles for Highly Controlled Dispensing
  • Singulating Soft Wafer Material: Zinc Oxide (ZnO)
  • Singulating Grooved Wafers
  • Singulating Hard Wafer Material: SiC
  • Diamond Brazing Technology: Diamond Nanoindenter
  • Perfect Wafer Scribing with Tool Setting

Join Us

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About Us

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  • Our Promise
  • Global Network

Contact Us

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FAQ

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