News Archives

We have created a new product page to describe our newly released line of completely customizable diamond pickup tools. See it here: https://us.tecdia.com/products-services/diamond-products-overview/diamond-pickup-tools/

We have uploaded a new case study to showcase the latest in Tecdia ingenuity… helping out the automotive liquid crystal industry with a new low-cost, durable diamond pickup tool. Check it our here: https://us.tecdia.com/casestudies/diamond-pickup-tool/

We have uploaded a new case study showcase the latest in Tecdia nozzle capabilities. Check it our here: https://us.tecdia.com/casestudies/super-long-tipped-nozzles/

March 13-15, Tecdia will be exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) show in San Diego, CA. This year we will be showcasing our latest ceramic products, thin film substrate line and contract manufacturing/micro-assembly services. Please visit us in booth 4731!
http://www.ofcconference.org/en-us/home/

We are pleased to announce that we have transferred our Wafer Processing Equipment Business Division to our company Kumasan Medix Co., Ltd. as described below.
For details, click here.

Date of business transfer agreement conclusion: December 13 2017
Business transfer date: January 31 2018

October 10-12, Tecdia exhibited at the 2017 European Microwave Week Exhibition in Nuremburg, Germany at booth 143. Thank you to all that stopped by and asked us about our single layer capacitors (with new backside AuSn!and the latest capabilities of our HCT alumina/aluminum nitride substrate line.
http://www.eumweek.com/

June 6-8, Tecdia will be exhibiting at the 2017 MTTS International Microwave Symposium in Honolulu, Hawaii at booth 708. Stop by and ask us about our single layer capacitors and the latest capabilities of our HCT alumina/aluminum nitride substrate line.
http://www.ims2017.org/

April 25-27, Tecdia will be exhibiting at the Electronic Design Innovation Conference (EDICON 2017) at the Shanghai Convention & Exhibition Center of International Sourcing in China at booth 113. We will be showcasing our single layer ceramic capacitors and alumina thin film circuit boards in addition to introducing our ceramic circuit production technologies (HCT – Hybrid Ceramic Technologies).
http://www.ediconchina.com/

March 21-23, Tecdia will be exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) show in Los Angeles, CA. This year we will be showcasing the latest in high performance Lightwave submount design with fine patterning and 3D shapes. Please visit us in booth 1940!
http://www.ofcconference.org/en-us/home/

We have added a case study about Tecdia’s new Ground Block to our case study library to share a little information on the origins of the Ground Block.
https://us.tecdia.com/casestudies/ground-block-using-conductive-ceramic/