Tecdia Exhibiting at ICEF (China Electronics Fair) 2021
July 12th, 2021
Tecdia will be attending the ICEF (China Electronics Fair) on July 15th – July 17th 2021.
We will be showcasing our Single Layer Wire Bondable Capacitors that can be applied to 5G and satellite communications, precision machining products and our Diamond tools!
Our booth number will be 4B253!
Come visit our booth!
For more details about the conference, you can Click Here.