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Tecdia Exhibits at 2014 Electronic Design Innovation Conference in China

April 8th, 2014

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Tecdia exhibited at the Electronic Design Innovation Conference (EDICON 2014) in Beijing, China at booth #611. We showcased Single Layer Ceramic Chip Capacitors, “ALTAS” Ultra Hi-K products, Broadband High Current Bias-T’s, and DC Power Boards for FET protection on April 8th through 10th.
http://www.ediconchina.com/

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