2019
New Rectangular SLC for GaN Applications Case Study
November 15th, 2019
A new case study to share how our new high aspect ratio single layer capacitors can be used to enhance GaN applications has been added to our case study page. Check it our here: https://us.tecdia.com/casestudies/growing-focus-on-revolutionary-gan-technology/
Tecdia Exhibiting at CIOE 2019
August 21st, 2019
From September 4, 2019 until September 7, 2019, Tecdia exhibited at CIOE 2019 (China International Optoelectronic Exposition) in Shenzhen, China. Thank you to those who visited us at booth 1A87-7/1A87-8 to learn more about our advanced ceramic products, thin film circuit technology, precision machining technologies, and custom-order production service. See here for details: http://www.cioe.cn/en/zsml/bull_detail_533.html
New Predeposited AuSn Solder Case Study
June 25th, 2019
A new case study to share our new AuSn solder-ready single layer capacitors has been added to the case study page. Check it our here: https://us.tecdia.com/casestudies/ceramic-capacitor-with-predeposited-solder/
New One-Stop Manufacturing/Assembly Case Study
March 21st, 2019
We have uploaded a new case study to outline our new services combining Tecdia-made electronic components, consigned miscellaneous components and in-house assembly capabilities. Check it our here: https://us.tecdia.com/casestudies/one-stop-manufacturing-assembly-services/
Tecdia Exhibiting at OFC 2019
January 25th, 2019
March 5-7, Tecdia will be exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) show in San Diego, CA. This year we will be showcasing the latest in optical sub-assembly and thin film ceramic capacitors and resistors. Please visit us in booth 4226!
http://www.ofcconference.org/en-us/home/
