2017
Wafer Processing Equipment Business Division Transfer
December 21st, 2017
We are pleased to announce that we have transferred our Wafer Processing Equipment Business Division to our company Kumasan Medix Co., Ltd. as described below.
For details, click here.Date of business transfer agreement conclusion: December 13 2017
Business transfer date: January 31 2018Tecdia Exhibiting at 2017 European Microwave Week
September 26th, 2017
October 10-12, Tecdia exhibited at the 2017 European Microwave Week Exhibition in Nuremburg, Germany at booth 143. Thank you to all that stopped by and asked us about our single layer capacitors (with new backside AuSn!and the latest capabilities of our HCT alumina/aluminum nitride substrate line.
http://www.eumweek.com/Tecdia Exhibiting at 2017 MTTS International Microwave Symposium
April 24th, 2017
June 6-8, Tecdia will be exhibiting at the 2017 MTTS International Microwave Symposium in Honolulu, Hawaii at booth 708. Stop by and ask us about our single layer capacitors and the latest capabilities of our HCT alumina/aluminum nitride substrate line.
http://www.ims2017.org/Tecdia Exhibiting at EDICON 2017
March 3rd, 2017
April 25-27, Tecdia will be exhibiting at the Electronic Design Innovation Conference (EDICON 2017) at the Shanghai Convention & Exhibition Center of International Sourcing in China at booth 113. We will be showcasing our single layer ceramic capacitors and alumina thin film circuit boards in addition to introducing our ceramic circuit production technologies (HCT – Hybrid Ceramic Technologies).
http://www.ediconchina.com/Tecdia Exhibiting at OFC 2017
January 31st, 2017
March 21-23, Tecdia will be exhibiting at the Optical Fiber Communication Conference and Exposition (OFC) show in Los Angeles, CA. This year we will be showcasing the latest in high performance Lightwave submount design with fine patterning and 3D shapes. Please visit us in booth 1940!
http://www.ofcconference.org/en-us/home/
