2015
Tecdia Exhibiting at 45th Internepcon Japan
December 22nd, 2015
January 13-15, Tecdia will be exhibiting at the 2016 Internepcon at Tokyo Big Sight, in Tokyo, Japan. We will be showcasing our dispensing nozzles along with our precision tools. See you there at Booth E5-34 in the East Exhibition Hall!
TECDIA, Co. Ltd. (Shanghai) Relocated
November 11th, 2015
TECDIA Co., Ltd. Shanghai has moved to a new location in order to meet growing business needs. For further contact information please see the link below:
https://us.tecdia.com/about-us-global-network/New Case Study: Verdis Dispensing Nozzles used in 3D Bioprinting Research
October 13th, 2015
Please visit the below link to see Tecdia’s latest case study, “Verdis Dispensing Nozzles used in 3D Bioprinting Research”.
Tecdia will be showcasing our Verdis dispensing nozzles and other precision products at the 2015 International Touch Panel and Optical Film Exhibition, August 26th to 28th. Come see us at booth I221 at Nangang Exhibition Hall in Taipei, Taiwan
http://www.touchtaiwan.com/en/index.aspTecdia Exhibiting at Transport System Expo 2015 (Tokyo, Japan)
April 29th, 2015
Tecdia will be showcasing our commuter safety system for children and the elderly, Kids Beacon (R) and Silver Beacon (R). See us at booth 1-2-9 at Tokyo Big Sight, May 27th to 29th.
http://www.truckexpo.jp/2015/en/index.htmlTecdia will be showcasing our commuter safety system for children and the elderly, Kids Beacon (R) and Silver Beacon (R). See us at booth 8-7 in the Security Zone at Tokyo Big Sight, May 20th to 22nd.
http://www.edix-expo.jp/en/Sequencing Power Supply Board Discontinuation Notice
April 1st, 2015
Due to RoHS restrictions in 2016, Tecdia will be discontinuing Sequencing Power Supply Boards.
Last Order Date: December 31, 2015
Last Delivery Date: March 31, 2016Tecdia Exhibiting at 2015 MTTS International Microwave Symposium
March 18th, 2015
May 19-21, Tecdia will be exhibiting at the 2015 MTTS International Microwave Symposium in Phoenix, Arizona at booth 1345. We will showcase our latest HCT (Hybrid Ceramic Technologies) and single layer chip capacitors.
Tecdia Exhibiting at OFC 2015
February 25th, 2015
(March 24-26, 2015) Tecdia will be exhibiting at the Optical Fiber Coummunication Conference and Exposition (OFC) show in Los Angeles, CA. This year we will be showcasing the latest in high performance Lightwave submount design with fine patterning and 3D shapes. Please visit us in booth 2416!
Tecdia Exhibiting at ATEM Fair 2015
February 14th, 2015
Tecdia is exhibiting at the 2015 ATEM Fair (7th International Adhesive, Coasting and Film System Fair) at Songdo Convensia in Incheon Korea at Booth #I121 from March 18th to 20th. We will be showcasing our dispensing nozzles and precision tools. See you there!