December 4th, 2013
“Diamond Indenter” page has been added to the Diamond Industrial Products line.
November 27th, 2013
Tecdia exhibited at the Microwave Workshops & Exhibition (MWE 2013) being held at the Pacifico Yokohama in Kanagawa, Japan at booth C601. We will showcase our brand new ceramic thin film technology along with Single Layer Capacitors, Wide-Band/High-Voltage Bias-Ts, DC Power Boards, and Contract Manufacturing Services on November 27th through 29th.
November 11th, 2013
Cebu Microelectronics Inc (CMI)- Tecdia’s fully owned contract facility located in the Philippines has remained intact following the devastating Haiyan Typhoon. We are fortunate to report our employees and facility are safe and operations are normal.
November 1st, 2013
To meet growing business and to further improve our customer service, Tecdia Taiwan office has been relocated from Tao Yuan City to New Taipei City.
October 21st, 2013
An instructional video has been added to the “Handy Wafer Scriber” page.
September 23rd, 2013
Tecdia exhibited at the European Conference on Optical Communications (ECOC 2013) being held at the ICC London ExCel. We showcased our IRC (Integrated Resistor-Capacitor) and “ALTAS” Ultra Hi-K Row Capacitors for 40G and 100G applications. We also demonstrated new developments in ceramic technology, offering unconventional shapes in fully customizable substrates on September 23rd through 25th.
September 4th, 2013
Tecdia exhibited at the 15th annual China Int’l Optoelectronic Expo (CIOE 2013) in Shenzhen, China. We highlighted our “ALTAS” Ultra Hi-K Single Layer Capacitors and Precision Dispensing Nozzles on September 4th through 7th.
June 18th, 2013
Tecdia exhibited at the OPTO Taiwan which was held in Taipei. We showcased our Precision Nozzles, Handy Wafer Scriber, High-Speed Grinding Wheel, and our Dressless Wheel on June 18th through 20th.
June 4th, 2013
Tecdia exhibited at the 2013 IEEE MTTS International Microwave Symposium in Seattle, Washington. We showcased the IRC (Integrated Resistor and Capacitor), “ALTAS” Ultra Hi-K Row Capacitors, GaN Bias-T’s and DC Power boards. We also demonstrated new developments in ceramic technology, offering unconventional shapes in fully customizable substrates on June 4th through 6th.
June 1st, 2013
To expand our service, Tecdia Japan Headquarters has moved to new location at 4-3-4 Shibaura, Minato-ku Tokyo.