Singulating Soft Wafer Material: Zinc Oxide (ZnO)
Singulation of soft zinc oxide (ZnO) semiconductor wafers can be a difficult challenge. Tecdia offers solution by creating uniquely-shaped, diamond-tipped scribers.
Electronic devices are being developed using a variety of materials. There are sometimes cases, however, where the die singulation process is challenging. Here is one way that our scribing specialists at Tecdia have made it easier.
The conventional scribe and break methods for singulation of ZnO wafers produces a low yield of acceptable die. Sawing or laser scribing are not good alternatives because the wafer material is easily damaged by high heat and coolants. This has stymied mass product production.
We began by developing a new tip design for the scribing tools we had already produced. Prototypes were made using our unique in-house diamond polishing technologies. Then we narrowed down parameters to optimize the singulation process.
The customer chose Tecdia because we know scribing tool technology and scribing processes as an equipment designer and manufacturer. We possess unique diamond craftsmanship, and we are a company that is committed to working with customers in order to find customized solutions to their manufacturing requirements. To Tecdia, the design should produce results that exceed the customer’s expectations; this is our tradition.
We began by selecting the “heel” type scribe tool, and developed a right geometry to ensure sharp and deep cuts allowing good internal crack to occur. Then we perfected scribing technique by using Tecdia brand scribing equipment to experiment with a rich variety of cutting methods. Using what we learned, we added a feature to our machine for selection of material cutting characteristics. In addition to being able to specify various scribing conditions like weight (stress) and speed, the result was a clean and neat separation of diced chips on the holding tape. Scribed straight down the “streets.”
Scribing Diamond Tip