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Wafer Processing Equipment

Wafer Breaking 6-inch

Wafer Breaking 6-inch

Fully automatic breaking, the next generation.

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Features

  • Standardized for 6-inch wafers
    -Can also be used for wafers from 2 to 4 inches by changing the break blade and work table.
  • Break detection function
    -Eliminates secondary breaking errors.
  • High efficiency wafer transport system
    -Double-armed transport shortens wafer loading time.
  • Accurate image recognition functions
    -The clarity of the machine’s optical system reduces matching errors in image recognition.

Accessories

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Dimensions (width × depth × height) / weight

1516mm × 862mm × 1506mm / 650kg

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