Wafer Breaking 4-inch
Fully Automatic Breaking Machine for 4-inch Wafers (Model No.: TEC-1018AR) Fully automatic breaking machine ideal for a wide range of operations from die to package breaking.
- Fully automated operation with image recognition
-All wafer processing from the loading to unloading is carried out automatically based on image recognition.
- Automatic wafer alignment function
-Has an auto-alignment function, indispensable in fully automatic breaking.
- Break detection function
-Eliminates secondary breaking errors.
- High stability design
-Enables breaking wafers into very small chips.
- Large capacity loading/unloading system
-Cassettes that can hold up to 25 rings are available.
- Custom breaking blades
-We can customize the tip shape of your breaking blade.
Dimensions (width × depth × height) / weight
1166m × 862mm × 1963mm / 550kg