Wafer Scribing Tools
Scribing Tool Selection
Toe vs Heel Tool Cutting Angle
Utilize the tip of the cut point diamond for narrow and shallow scribe lines
Use a lower triangular point, creating a wider and deeper scribe line
Tecdia Scribe Tool Benefits
Best in Class Tool
Each tool is meticulously crafted and inspected to only the highest standards for shank uniformity, diamond positioning and cutting angles.
High Yield Potential
Our standard shank is designed to work with most commercially available scribing platforms. Although not recommended for best performance, our tools can be used in hand scribing applications.
Tecdia scribe tools are designed for longevity and maximum wafer singulation yield. Diamonds are bonded to the shank through a proprietary method that yields extremely accurate alignment geometries.