News Archives

2014

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    January 14-16, Tecdia will be exhibiting at the 2015 Internepcon in Tokyo Big Sight, Japan. We will be showcasing our dispensing nozzles, diamond technologies and precision tools. See you there at Booth 12-13 in the East Exhibition Hall!

    http://www.nepcon.jp/en/

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    Tecdia is exhibiting at the 2015 MD&M West in Anaheim, CA at booth 2982 from February 10th through 12th. We will showcase our bio-printing dispensing nozzles and systems. See you there!

    http://mdmwest.mddionline.com/

  • Tecdia Inc. opens Europe Branch

    November 17th, 2014

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    To meet growing business needs and to further improve our customer service, Tecdia Inc. has opened a new branch office in Europe on November 17, 2014.

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    HCT (Hybrid Ceramic Technologies) combines over 35 years of experience in ceramics, machining, wafer processing, and micro-circuits into one group…

  • Exhibition at the 2014 ECOC

    August 20th, 2014

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    Our Tecdia Inc. (US) office was relocated to Campbell, CA – about 10 miles south of our previous Santa Clara office.

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    Handy Wafer Scriber has been added to our Solutions section.

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    Handy Wafer Scriber has been added to our Solutions section.

  • Tecdia Inc. (US) Relocated

    June 23rd, 2014

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    Our Tecdia Inc. (US) office was relocated to Campbell, CA – about 10 miles south of our previous Santa Clara office.

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    • Comments Off on TECDIA, Co. LTD. (KOREA) Relocated

    TECDIA Co., Ltd. KOREA has moved to a new location at #704, 303 Hyowon-ro, Paldal-gu Suwon, Gyeonggi-do, Korea 442-835.

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    Tecdia exhibited at the 2014 MTTS International Microwave Symposium held in the Tampa Convention Center located in Tampa Bay, Florida (Booth 1818).